Inventor
CULLINAN DEBORAH A
US3 patents
Patents
3 patentsUS5874319AFeb 23, 1999
Vacuum die bond for known good die assembly
HONEYWELL INC28 citations90
US5719748AFeb 17, 1998
Semiconductor package with a bridge for chip area connection
HONEYWELL INC17 citations82
US5773311AJun 30, 1998
Method for providing a test connection and a permanent connection site on an unpackaged semiconductor die
HONEYWELL INC4 citations60