Inventor

KUBOTA NORIYUKI

JP4 patents

Patents

4 patents

US6474529B2Nov 5, 2002

Wire bonding apparatus

NEC CORP9 citations71

US6533158B2Mar 18, 2003

Wire bonding apparatus having wire clamp

NEC CORP6 citations66

US6516991B2Feb 11, 2003

Wire bonding apparatus

NEC CORP2 citations59

US7654207B1Feb 2, 2010

XY stage

NEC CORP4 citations52