Inventor

HUI MAN HO

SG3 patents

Patents

3 patents

US6770163B1Aug 3, 2004

Mold and method for encapsulation of electronic device

ASM TECH SINGAPORE PTE LTD81 citations92

US6860731B2Mar 1, 2005

Mold for encapsulating a semiconductor chip

ASM TECH SINGAPORE PTE LTD5 citations59

US6709252B2Mar 23, 2004

Molding apparatus

ASM TECH SINGAPORE PTE LTD1 citations50