Inventor
WU CHII-MING MORRIS
TW4 patents
Patents
4 patentsUS7223673B2May 29, 2007
Method of manufacturing semiconductor device with crack prevention ring
TAIWAN SEMICONDUCTOR MFG40 citations94
US5920081AJul 6, 1999
Structure of a bond pad to prevent testing probe pin contamination
TAIWAN SEMICONDUCTOR MFG33 citations89
US8354734B2Jan 15, 2013
Semiconductor device with crack prevention ring
TAIWAN SEMICONDUCTOR MFG10 citations82
US7586176B2Sep 8, 2009
Semiconductor device with crack prevention ring
TAIWAN SEMICONDUCTOR MFG7 citations72