Inventor
CHEN CHI-SHI
TW3 patents
Patents
3 patentsUS8274794B2Sep 25, 2012
Three-dimensional SoC structure formed by stacking multiple chip modules
HUANG CHUN-MING10 citations81
US8199510B2Jun 12, 2012
Multi-layer SoC module structure
HUANG CHUN-MING1 citations49
US8399303B1Mar 19, 2013
Method for manufacturing modularized integrated circuit
HUANG CHUN-MING0 citations39