Inventor · disambiguated record
James H. Knapp
Also filed as: KNAPP JAMES · KNAPP JAMES H · KNAPP JAMES HOWARD
31 granted patents·1,664 citations·filing 1988–2003
98Inventor score
Top patents by PatentIndex Score
31 records- 0196US6300679B1Flexible substrate for packaging a semiconductor componentSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Oct 9, 2001·239 cites·30 claims
- 0295US5768456AOptoelectronic package including photonic device mounted in flexible substrateMOTOROLA INC·Filed 1996·Granted Jun 16, 1998·169 cites·18 claims
- 0392US5895229AMicroelectronic package including a polymer encapsulated die, and method for forming sameMOTOROLA INC·Filed 1997·Granted Apr 20, 1999·128 cites·11 claims
- 0491US6093972AMicroelectronic package including a polymer encapsulated dieMOTOROLA INC·Filed 1999·Granted Jul 25, 2000·125 cites·5 claims
- 0589US6677672B2Structure and method of forming a multiple leadframe semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jan 13, 2004·48 cites·20 claims
- 0689US5973337ABall grid device with optically transmissive coatingMOTOROLA INC·Filed 1997·Granted Oct 26, 1999·106 cites·10 claims
- 0788US5834062AMaterial transfer apparatus and method of using the sameMOTOROLA INC·Filed 1997·Granted Nov 10, 1998·71 cites·21 claims
- 0887US7227240B2Semiconductor device with wire bond inductor and methodSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jun 5, 2007·57 cites·18 claims
- 0987US5933558AOptoelectronic device and method of assemblyMOTOROLA INC·Filed 1997·Granted Aug 3, 1999·90 cites·20 claims
- 1083US6713317B2Semiconductor device and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Mar 30, 2004·35 cites·16 claims
- 1182US6116791AOptical coupler and method for coupling an optical fiber to an optoelectric deviceMOTOROLA INC·Filed 1998·Granted Sep 12, 2000·65 cites·22 claims
- 1282US5883996AElectronic component for aligning a light transmitting structureMOTOROLA INC·Filed 1997·Granted Mar 16, 1999·59 cites·13 claims
- 1382US5468910ASemiconductor device package and method of makingMOTOROLA INC·Filed 1995·Granted Nov 21, 1995·71 cites·13 claims
- 1479US5761364AOptical waveguideMOTOROLA INC·Filed 1995·Granted Jun 2, 1998·56 cites·23 claims
- 1576US5118271AApparatus for encapsulating a semiconductor deviceMOTOROLA INC·Filed 1991·Granted Jun 2, 1992·57 cites·6 claims
- 1675US6833290B2Structure and method of forming a multiple leadframe semiconductor deviceSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 21, 2004·18 cites·19 claims
- 1774US5319242ASemiconductor package having an exposed die surfaceMOTOROLA INC·Filed 1992·Granted Jun 7, 1994·54 cites·11 claims
- 1873US6835580B1Direct chip attach structure and methodSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Dec 28, 2004·28 cites·20 claims
- 1973US5928595AMethod of manufacturing a semiconductor componentMOTOROLA INC·Filed 1997·Granted Jul 27, 1999·32 cites·7 claims
- 2073US5659648APolyimide optical waveguide having electrical conductivityMOTOROLA INC·Filed 1995·Granted Aug 19, 1997·38 cites·20 claims
- 2171US4877482ANitride removal methodMOTOROLA INC·Filed 1989·Granted Oct 31, 1989·17 cites·15 claims
- 2270US6747341B2Integrated circuit and laminated leadframe packageSEMICONDUCTOR COMPONENTS IND·Filed 2002·Granted Jun 8, 2004·17 cites·18 claims
- 2367US6081031ASemiconductor package consisting of multiple conductive layersSEMICONDUCTOR COMPONENTS IND·Filed 1998·Granted Jun 27, 2000·27 cites·20 claims
- 2452US5900669ASemiconductor componentMOTOROLA INC·Filed 1997·Granted May 4, 1999·20 cites·14 claims
- 2546US4975146APlasma removal of unwanted materialMOTOROLA INC·Filed 1989·Granted Dec 4, 1990·9 cites·8 claims
- 2642US5637264AMethod of fabricating an optical waveguideMOTOROLA INC·Filed 1995·Granted Jun 10, 1997·12 cites·20 claims
- 2738US7109064B2Method of forming a semiconductor package and leadframe thereforSEMICONDUCTOR COMPONENTS IND·Filed 2003·Granted Sep 19, 2006·0 cites·13 claims
- 2837US8574961B2Method of marking a low profile packaged semiconductor deviceKNAPP JAMES HOWARD·Filed 2003·Granted Nov 5, 2013·1 cites·10 claims
- 2934US4795077ABonding method and apparatusMOTOROLA INC·Filed 1988·Granted Jan 3, 1989·7 cites·13 claims
- 3033US5529682AMethod for making semiconductor devices having electroplated leadsMOTOROLA INC·Filed 1995·Granted Jun 25, 1996·3 cites·14 claims
- 3133US5182071AMethod of molding a carrier ring to leadsMOTOROLA INC·Filed 1990·Granted Jan 26, 1993·5 cites·12 claims
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