Inventor
CHU YUDE
TW8 patents
Patents
8 patentsUS6781222B2Aug 24, 2004
Semiconductor package having vertically mounted passive devices under a chip and a fabricating method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD34 citations92
US10587037B2Mar 10, 2020
Electronic package structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9997477B2Jun 12, 2018
Method of manufacturing semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9337250B2May 10, 2016
Semiconductor package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US9502758B2Nov 22, 2016
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations50
US9355989B2May 31, 2016
Wire bonding device and method of eliminating defective bonding wire
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations43
US9502377B2Nov 22, 2016
Semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9289846B2Mar 22, 2016
Method for fabricating wire bonding structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations39