Inventor
ICHIKAWA SEIJI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “ICHIKAWA SEIJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
14 patentsUS6104086AAug 15, 2000
Semiconductor device having lead terminals bent in J-shape
NEC CORP167 citations98
US6242797B1Jun 5, 2001
Semiconductor device having pellet mounted on radiating plate thereof
NEC CORP31 citations92
US5905301AMay 18, 1999
Mold package for sealing a chip
NEC CORP45 citations92
US5889232AMar 30, 1999
Ultrahigh-frequency electronic component
NEC CORP19 citations92
US6011303AJan 4, 2000
Electronic component
NEC CORP48 citations91
US6175150B1Jan 16, 2001
Plastic-encapsulated semiconductor device and fabrication method thereof
NEC CORP18 citations81
US6319753B1Nov 20, 2001
Semiconductor device having lead terminals bent in J-shape
NEC CORP12 citations73
US6165818ADec 26, 2000
Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame
NEC CORP7 citations73
US6150715ANov 21, 2000
Semiconductor device with radiation plate for high radiation character and method of manufacturing the same
NEC CORP14 citations73
US5970322AOct 19, 1999
Ultrahigh-frequency electronic component and method of manufacturing the same
NEC CORP15 citations73
US5904501AMay 18, 1999
Hollow package manufacturing method
NEC CORP9 citations73
US5956574ASep 21, 1999
Lead frame flash removing method and apparatus
NEC CORP7 citations72
US6467666B2Oct 22, 2002
Method of producing a semiconductor device
NEC CORP10 citations66
US6177720B1Jan 23, 2001
Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame
NEC CORP3 citations62