Inventor
HIROKAWA TOMOAKI
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HIROKAWA TOMOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
7 patentsUS5905301AMay 18, 1999
Mold package for sealing a chip
NEC CORP45 citations92
US5889232AMar 30, 1999
Ultrahigh-frequency electronic component
NEC CORP19 citations92
US6011303AJan 4, 2000
Electronic component
NEC CORP48 citations91
US5970322AOct 19, 1999
Ultrahigh-frequency electronic component and method of manufacturing the same
NEC CORP15 citations73
US5904501AMay 18, 1999
Hollow package manufacturing method
NEC CORP9 citations73
US5956574ASep 21, 1999
Lead frame flash removing method and apparatus
NEC CORP7 citations72
US6340792B1Jan 22, 2002
Mold cap for semiconductor device mold package
NEC CORP6 citations61