Inventor

SHI HONGBIN

CN9 patents

⚠️ This page may combine multiple inventors who share the name “SHI HONGBIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHI HONGBIN

3 patents

US9985008B2May 29, 2018

Method of fabricating a semiconductor package

SHI HONGBIN6 citations69

US9953964B2Apr 24, 2018

Method for manufacturing semiconductor package

SHI HONGBIN1 citations46

US9786644B2Oct 10, 2017

Methods of fabricating a semiconductor package

SHI HONGBIN1 citations41

HUAWEI TECH CO LTD

3 patents

US11011477B2May 18, 2021

High-reliability electronic packaging structure, circuit board, and device

HUAWEI TECH CO LTD1 citations59

US11367700B2Jun 21, 2022

Electronic package, terminal and method for processing electronic package

HUAWEI TECH CO LTD0 citations45

US12369249B2Jul 22, 2025

Printed circuit board assembly and electronic device

HUAWEI TECH CO LTD0 citations42

SAMSUNG ELECTRONICS CO LTD

2 patents

US10050020B2Aug 14, 2018

Stack-type semiconductor package

SAMSUNG ELECTRONICS CO LTD1 citations50

US9728516B2Aug 8, 2017

Electric apparatus including electric patterns for suppressing solder bridges

SAMSUNG ELECTRONICS CO LTD0 citations36

ZTE CORP

1 patent

US9590798B2Mar 7, 2017

Synchronization system, method and master/slave optical module device for detecting asymmetry of optical fibers

ZTE CORP0 citations40