Inventor
DEI Kanta
JP11 patents
Patents
11 patentsUS12569941B2Mar 10, 2026
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device
SENJU METAL INDUSTRY CO1 citations62
US12576463B2Mar 17, 2026
Lead-free and antimony-free solder alloy, solder ball, and solder joint
SENJU METAL INDUSTRY CO0 citations60
US12447564B2Oct 21, 2025
Solder alloy, solder ball, and solder joint
SENJU METAL INDUSTRY CO0 citations60
US12383987B2Aug 12, 2025
Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint
SENJU METAL INDUSTRY CO0 citations60
US12377500B2Aug 5, 2025
Lead-free and antimony-free solder alloy, solder ball, and solder joint
SENJU METAL INDUSTRY CO0 citations60
US12080671B2Sep 3, 2024
Layered bonding material, semiconductor package, and power module
SENJU METAL INDUSTRY CO0 citations60
US12053843B2Aug 6, 2024
Solder alloy, solder paste, solder ball, solder preform, solder joint, in-vehicle electronic circuit, ECU electronic circuit, in-vehicle electronic circuit device and ECU electronic circuit device
SENJU METAL INDUSTRY CO1 citations60
US11633815B2Apr 25, 2023
Solder paste
SENJU METAL INDUSTRY CO1 citations60
US12583061B2Mar 24, 2026
Solder alloy, solder paste, and solder joint
SENJU METAL INDUSTRY CO0 citations58
US12583060B2Mar 24, 2026
Solder alloy, solder ball and solder joint
SENJU METAL INDUSTRY CO0 citations56
US11607753B2Mar 21, 2023
Solder alloy, cast article, formed article, and solder joint
SENJU METAL INDUSTRY CO0 citations49