Inventor
PALMER MICHAEL JON
US12 patents
⚠️ This page may combine multiple inventors who share the name “PALMER MICHAEL JON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS5948286ASep 7, 1999
Diffusion bonding of lead interconnections using precise laser-thermosonic energy
IBM34 citations92
US5641114AJun 24, 1997
Controlled temperature bonding
IBM8 citations73
US5675884AOct 14, 1997
Apparatus for multilayer conductor chip packaging
IBM6 citations72
US5669437ASep 23, 1997
High efficiency thermal interposer
IBM9 citations72
US5847926ADec 8, 1998
Lightweight packaging
IBM11 citations71
US5734196AMar 31, 1998
Electronic packaging shaped beam lead fabrication
IBM12 citations69
US6403892B1Jun 11, 2002
Coated means for connecting a chip and a card
IBM6 citations65
US5915462AJun 29, 1999
High efficiency thermal interposer
IBM5 citations61
US6734363B1May 11, 2004
Lightweight electronic equipment conductor with coolant permeable support
IBM6 citations60
US6295128B1Sep 25, 2001
Optical alignment of superpositioned objects
IBM0 citations51
US5687078ANov 11, 1997
Fine pitch bonding
IBM0 citations51