Inventor
YAHYAEI-MOAYYED FARZANEH
US9 patents
Patents
9 patentsUS6586684B2Jul 1, 2003
Circuit housing clamp and method of manufacture therefor
INTEL CORP42 citations93
US6877223B2Apr 12, 2005
Method of fabrication for a socket with embedded conductive structure
INTEL CORP16 citations92
US6558181B2May 6, 2003
System and method for package socket with embedded power and ground planes
INTEL CORP30 citations90
US6975518B2Dec 13, 2005
Printed circuit board housing clamp
INTEL CORP25 citations88
US7212395B2May 1, 2007
Capacitor design for controlling equivalent series resistance
INTEL CORP8 citations73
US6428358B1Aug 6, 2002
Socket with embedded conductive structure and method of fabrication therefor
INTEL CORP13 citations73
US6584685B2Jul 1, 2003
System and method for package socket with embedded power and ground planes
INTEL CORP10 citations71
US6784532B2Aug 31, 2004
Power/ground configuration for low impedance integrated circuit
INTEL CORP6 citations62
US12578363B2Mar 17, 2026
Device, method and system to sense voltages at sample points of respective interconnect structures
INTEL CORP0 citations46