Inventor · disambiguated record
Kenneth Cadien
Also filed as: CADIEN KENNETH · CADIEN KENNETH C
37 granted patents·14 pending applications·1,981 citations·filing 1993–2025
98Inventor score
Top patents by PatentIndex Score
51 records- 0198US7345479B2Portable NMR device and method for making and using the sameINTEL CORP·Filed 2005·Granted Mar 18, 2008·62 cites·53 claims
- 0298US7274191B2Integrated on-chip NMR and ESR device and method for making and using the sameINTEL CORP·Filed 2005·Granted Sep 25, 2007·62 cites·72 claims
- 0398US5340370ASlurries for chemical mechanical polishingINTEL CORP·Filed 1993·Granted Aug 23, 1994·410 cites·20 claims
- 0496US5783478AMethod of frabricating a MOS transistor having a composite gate electrodeINTEL CORP·Filed 1996·Granted Jul 21, 1998·157 cites·10 claims
- 0596US5625217AMOS transistor having a composite gate electrode and method of fabricationINTEL CORP·Filed 1995·Granted Apr 29, 1997·162 cites·4 claims
- 0695US5407526AChemical mechanical polishing slurry delivery and mixing systemINTEL CORP·Filed 1993·Granted Apr 18, 1995·171 cites·20 claims
- 0794US5700383ASlurries and methods for chemical mechanical polish of aluminum and titanium aluminideINTEL CORP·Filed 1995·Granted Dec 23, 1997·176 cites·42 claims
- 0894US5611943AMethod and apparatus for conditioning of chemical-mechanical polishing padsINTEL CORP·Filed 1995·Granted Mar 18, 1997·120 cites·31 claims
- 0992US6046099APlug or via formation using novel slurries for chemical mechanical polishingINTEL CORP·Filed 1999·Granted Apr 4, 2000·89 cites·21 claims
- 1092US5954975ASlurries for chemical mechanical polishing tungsten filmsINTEL CORP·Filed 1997·Granted Sep 21, 1999·90 cites·39 claims
- 1192US5516346ASlurries for chemical mechanical polishingINTEL CORP·Filed 1994·Granted May 14, 1996·106 cites·14 claims
- 1288US6443814B1Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2001·Granted Sep 3, 2002·35 cites·9 claims
- 1388US5836806ASlurries for chemical mechanical polishingINTEL CORP·Filed 1996·Granted Nov 17, 1998·60 cites·30 claims
- 1487US6178585B1Slurries for chemical mechanical polishingINTEL CORP·Filed 2000·Granted Jan 30, 2001·25 cites·6 claims
- 1585US6464568B2Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2000·Granted Oct 15, 2002·27 cites·18 claims
- 1683US6375552B1Slurries for chemical mechanical polishingINTEL CORP·Filed 2000·Granted Apr 23, 2002·18 cites·12 claims
- 1783US6087733ASacrificial erosion control features for chemical-mechanical polishing processINTEL CORP·Filed 1998·Granted Jul 11, 2000·77 cites·3 claims
- 1876US11949019B2Thin film semiconductor switching deviceZINITE CORP·Filed 2023·Granted Apr 2, 2024·0 cites·30 claims
- 1975US7800371B2Portable NMR device and method for making and using the sameINTEL CORP·Filed 2007·Granted Sep 21, 2010·3 cites·11 claims
- 2075US6740591B1Slurry and method for chemical mechanical polishing of copperINTEL CORP·Filed 2000·Granted May 25, 2004·17 cites·6 claims
- 2175US6719614B2Method and chemistry for cleaning of oxidized copper during chemical mechanical polishingINTEL CORP·Filed 2002·Granted Apr 13, 2004·13 cites·3 claims
- 2274US7476974B2Method to fabricate interconnect structuresINTEL CORP·Filed 2006·Granted Jan 13, 2009·4 cites·12 claims
- 2373US12446258B2Thin film semiconductor switching deviceZINITE CORP·Filed 2025·Granted Oct 14, 2025·0 cites·30 claims
- 2473US8829442B2Non-contact measurement of the dopant content of semiconductor layersHEAVEN E MICHAEL·Filed 2011·Granted Sep 9, 2014·6 cites·29 claims
- 2569US7087517B2Method to fabricate interconnect structuresINTEL CORP·Filed 2003·Granted Aug 8, 2006·11 cites·11 claims
- 2669US2024332426A1Thin film semiconductor switching deviceZINITE CORP·Filed 2022·Application pending·0 cites
- 2768US10830738B2Ultrasensitive high Q-factor AT-cut-quartz crystal microbalance femtogram mass sensorUNIV OF ALBERTA·Filed 2017·Granted Nov 10, 2020·1 cites·14 claims
- 2865US12302605B2Hafnium nitride adhesion layerZINITE CORP·Filed 2024·Granted May 13, 2025·0 cites·10 claims
- 2964US5604158AIntegrated tungsten/tungsten silicide plug processINTEL CORP·Filed 1996·Granted Feb 18, 1997·37 cites·18 claims
- 3062US2025220963A1Hafnium nitride adhesion layerZINITE CORP·Filed 2025·Application pending·0 cites
- 3158US2025204015A1Gate stack for field effect transistorsZINITE CORP·Filed 2023·Application pending·0 cites
- 3253US6358853B2Ceria based slurry for chemical-mechanical polishingINTEL CORP·Filed 1998·Granted Mar 19, 2002·19 cites·5 claims
- 3350US7087188B2Abrasives for chemical mechanical polishingINTEL CORP·Filed 2003·Granted Aug 8, 2006·2 cites·7 claims
- 3450US2016315196A1Buried source schottky barrier thin film transistor and method of manufactureUNIV ALBERTA·Filed 2014·Application pending·0 cites
- 3549US6752844B2Ceric-ion slurry for use in chemical-mechanical polishingINTEL CORP·Filed 1999·Granted Jun 22, 2004·11 cites·13 claims
- 3649US2020173898A1Process for detecting electrolyte and biomarker analyte levels with femtogram resolution in ionic solutionsSEIF SELEMANI·Filed 2018·Application pending·0 cites
- 3745US2017250287A1Buried source schottky barrier thin transistor and method of manufactureUNIV ALBERTA·Filed 2017·Application pending·0 cites
- 3843US2004203245A1Ceric-ion slurry for use in chemical-mechanical polishingFiled 2004·Application pending·0 cites
- 3943US2004203227A1Ceric-ion slurry for use in chemical-mechanical polishingFiled 2004·Application pending·0 cites
- 4042US7319323B2Device and method using magnetic pattern on diskINTEL CORP·Filed 2006·Granted Jan 15, 2008·0 cites·62 claims
- 4142US6909193B2High pH slurry for chemical mechanical polishing of copperINTEL CORP·Filed 2004·Granted Jun 21, 2005·0 cites·4 claims
- 4240US2003211745A1Slurry and method for chemical mechanical polishing of copperFiled 2003·Application pending·0 cites
- 4339US2006065627A1Processing electronic devices using a combination of supercritical fluid and sonic energyCLARKE JAMES·Filed 2004·Application pending·0 cites
- 4439US2006141780A1Methods for the plasma formation of a microelectronic barrier layerCADIEN KENNETH C·Filed 2004·Application pending·0 cites
- 4539US2002177316A1Slurry and method for chemical mechanical polishing of copperFiled 2002·Application pending·0 cites
- 4639US2006128144A1Interconnects having a recessed capping layer and methods of fabricating the samePARK HYUN-MOG·Filed 2004·Application pending·0 cites
- 4738US6825117B2High PH slurry for chemical mechanical polishing of copperINTEL CORP·Filed 1999·Granted Nov 30, 2004·6 cites·9 claims
- 4836US7666465B2Introducing nanotubes in trenches and structures formed therebyINTEL CORP·Filed 2004·Granted Feb 23, 2010·1 cites·16 claims
- 4935US7182882B2Method of improving chemical mechanical polish endpoint signals by use of chemical additivesINTEL CORP·Filed 2002·Granted Feb 27, 2007·0 cites·16 claims
- 5035US2006138087A1Copper containing abrasive particles to modify reactivity and performance of copper CMP slurriesSIMKA HARSONO S·Filed 2004·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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