Inventor

DUNNE RAJIV C

US2 patents

Patents

2 patents

US7790597B2Sep 7, 2010

Solder cap application process on copper bump using solder powder film

TEXAS INSTRUMENTS INC7 citations70

US7898069B2Mar 1, 2011

Stacked flip-assembled semiconductor chips embedded in thin hybrid substrate

TEXAS INSTRUMENTS INC1 citations42