Inventor
BROWN DIRK
US19 patents
⚠️ This page may combine multiple inventors who share the name “BROWN DIRK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
17 patentsUS6344410B1Feb 5, 2002
Manufacturing method for semiconductor metalization barrier
ADVANCED MICRO DEVICES INC292 citations99
US6144099ANov 7, 2000
Semiconductor metalization barrier
ADVANCED MICRO DEVICES INC319 citations99
US6228754B1May 8, 2001
Method for forming semiconductor seed layers by inert gas sputter etching
ADVANCED MICRO DEVICES INC87 citations98
US6124203ASep 26, 2000
Method for forming conformal barrier layers
ADVANCED MICRO DEVICES INC107 citations98
US6022808AFeb 8, 2000
Copper interconnect methodology for enhanced electromigration resistance
ADVANCED MICRO DEVICES INC105 citations98
US6734559B1May 11, 2004
Self-aligned semiconductor interconnect barrier and manufacturing method therefor
ADVANCED MICRO DEVICES INC59 citations96
US6239021B1May 29, 2001
Dual barrier and conductor deposition in a dual damascene process for semiconductors
ADVANCED MICRO DEVICES INC52 citations96
US6117770ASep 12, 2000
Method for implanting semiconductor conductive layers
ADVANCED MICRO DEVICES INC52 citations93
US6261946B1Jul 17, 2001
Method for forming semiconductor seed layers by high bias deposition
ADVANCED MICRO DEVICES INC42 citations92
US6187670B1Feb 13, 2001
Multi-stage method for forming optimized semiconductor seed layers
ADVANCED MICRO DEVICES INC45 citations92
US6147404ANov 14, 2000
Dual barrier and conductor deposition in a dual damascene process for semiconductors
ADVANCED MICRO DEVICES INC29 citations92
US6143650ANov 7, 2000
Semiconductor interconnect interface processing by pulse laser anneal
ADVANCED MICRO DEVICES INC42 citations92
US6121141ASep 19, 2000
Method of forming a void free copper interconnects
ADVANCED MICRO DEVICES INC39 citations92
US6080669AJun 27, 2000
Semiconductor interconnect interface processing by high pressure deposition
ADVANCED MICRO DEVICES INC19 citations92
US6066557AMay 23, 2000
Method for fabricating protected copper metallization
ADVANCED MICRO DEVICES INC21 citations92
US6146993ANov 14, 2000
Method for forming in-situ implanted semiconductor barrier layers
ADVANCED MICRO DEVICES INC18 citations84
US6059940AMay 9, 2000
Method for fabricating dual layer protective barrier copper metallization
ADVANCED MICRO DEVICES INC6 citations63