Inventor
DAMBRAUSKAS TONY
US9 patents
⚠️ This page may combine multiple inventors who share the name “DAMBRAUSKAS TONY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS9583390B2Feb 28, 2017
Organic thin film passivation of metal interconnections
INTEL CORP3 citations71
US9859248B2Jan 2, 2018
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations68
US7354799B2Apr 8, 2008
Methods for anchoring a seal ring to a substrate using vias and assemblies including an anchored seal ring
INTEL CORP8 citations65
US9824991B2Nov 21, 2017
Organic thin film passivation of metal interconnections
INTEL CORP1 citations61
US9412702B2Aug 9, 2016
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations58
US11935861B2Mar 19, 2024
Underfill flow management in electronic assemblies
INTEL CORP0 citations57
US7402501B2Jul 22, 2008
Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same
INTEL CORP0 citations49
US7427565B2Sep 23, 2008
Multi-step etch for metal bump formation
INTEL CORP1 citations41