Inventor
OKA MIHIR A
US7 patents
⚠️ This page may combine multiple inventors who share the name “OKA MIHIR A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS9859248B2Jan 2, 2018
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations68
US9412702B2Aug 9, 2016
Laser die backside film removal for integrated circuit (IC) packaging
INTEL CORP2 citations58
US10224299B2Mar 5, 2019
Sintered solder for fine pitch first-level interconnect (FLI) applications
INTEL CORP1 citations56
US10546823B2Jan 28, 2020
Apparatus and method for mitigating surface imperfections on die backside film using fluorocarbon material
INTEL CORP0 citations47
US10515914B2Dec 24, 2019
Sintered solder for fine pitch first-level interconnect (FLI) applications
INTEL CORP0 citations46