P

Inventor

JOHNSON ERIC A

US95 patents
⚠️ This page may combine multiple inventors who share the name “JOHNSON ERIC A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

21 patents
US6913948B2Jul 5, 2005

Partially captured oriented interconnections for BGA packages and a method of forming the interconnections

IBM126 citations99
US6507116B1Jan 14, 2003

Electronic package and method of forming

IBM107 citations98
US6274474B1Aug 14, 2001

Method of forming BGA interconnections having mixed solder profiles

IBM88 citations98
US6665186B1Dec 16, 2003

Liquid metal thermal interface for an electronic module

IBM138 citations97
US6288900B1Sep 11, 2001

Warpage compensating heat spreader

IBM88 citations97
US6104093AAug 15, 2000

Thermally enhanced and mechanically balanced flip chip package and method of forming

IBM92 citations97
US6774474B1Aug 10, 2004

Partially captured oriented interconnections for BGA packages and a method of forming the interconnections

IBM66 citations96
US6410988B1Jun 25, 2002

Thermally enhanced and mechanically balanced flip chip package and method of forming

IBM45 citations96
US5759269AJun 2, 1998

Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture

IBM41 citations95
US5638597AJun 17, 1997

Manufacturing flexible circuit board assemblies with common heat spreaders

IBM42 citations95
US4642618AFeb 10, 1987

Tool failure detector

IBM1,040 citations95
US6191952B1Feb 20, 2001

Compliant surface layer for flip-chip electronic packages and method for forming same

IBM64 citations93
US6933619B2Aug 23, 2005

Electronic package and method of forming

IBM34 citations92
US6541857B2Apr 1, 2003

Method of forming BGA interconnections having mixed solder profiles

IBM35 citations92
US6541847B1Apr 1, 2003

Packaging for multi-processor shared-memory system

IBM36 citations92
US6333551B1Dec 25, 2001

Surface profiling in electronic packages for reducing thermally induced interfacial stresses

IBM26 citations92
US6667557B2Dec 23, 2003

Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connections

IBM43 citations91
US6570259B2May 27, 2003

Apparatus to reduce thermal fatigue stress on flip chip solder connections

IBM43 citations91
US6040631AMar 21, 2000

Method of improved cavity BGA circuit package

IBM24 citations91
US5969945AOct 19, 1999

Electronic package assembly

IBM33 citations91
US5831828ANov 3, 1998

Flexible circuit board and common heat spreader assembly

IBM32 citations91

WISCONSIN ALUMNI RES FOUND

9 patents

CORAL SYSTEMS INC

2 patents

LIGHTBRIDGE INC

2 patents

ROHM & HAAS

2 patents

GIST BROCADES NV

2 patents

IGENE BIOTECHNOLOGY INC

2 patents

ASS SYNAPSE BIOLOG

1 patent

(unassigned)

1 patent

AUTHORIZE NET LLC

1 patent

STEINER INC S S

1 patent

VLSI TECHNOLOGY INC

1 patent

PRODOTTI ANTIBIOTICI SPA

1 patent

GIST BROCADES BV

1 patent

DSM NV

1 patent

US ENERGY

1 patent

ADVANCED DESIGN CONSULTING USA

1 patent

Showing the top 50 of 95 patents by PatentIndex Score.