Inventor
SCHOEPP ALAN M
US32 patents
⚠️ This page may combine multiple inventors who share the name “SCHOEPP ALAN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
23 patentsUS7858898B2Dec 28, 2010
Bevel etcher with gap control
LAM RES CORP349 citations99
US6320320B1Nov 20, 2001
Method and apparatus for producing uniform process rates
LAM RES CORP411 citations99
US9431268B2Aug 30, 2016
Isotropic atomic layer etch for silicon and germanium oxides
LAM RES CORP135 citations98
US6170429B1Jan 9, 2001
Chamber liner for semiconductor process chambers
LAM RES CORP233 citations98
US6341574B1Jan 29, 2002
Plasma processing systems
LAM RES CORP135 citations97
US6464843B1Oct 15, 2002
Contamination controlling method and apparatus for a plasma processing chamber
LAM RES CORP75 citations96
US6322661B1Nov 27, 2001
Method and apparatus for controlling the volume of a plasma
LAM RES CORP75 citations96
US6277237B1Aug 21, 2001
Chamber liner for semiconductor process chambers
LAM RES CORP75 citations96
US6361645B1Mar 26, 2002
Method and device for compensating wafer bias in a plasma processing chamber
LAM RES CORP83 citations95
US7943007B2May 17, 2011
Configurable bevel etcher
LAM RES CORP24 citations92
US6306244B1Oct 23, 2001
Apparatus for reducing polymer deposition on substrate support
LAM RES CORP28 citations92
US6302966B1Oct 16, 2001
Temperature control system for plasma processing apparatus
LAM RES CORP42 citations92
US6074516AJun 13, 2000
High sputter, etch resistant window for plasma processing chambers
LAM RES CORP30 citations92
US8721908B2May 13, 2014
Bevel etcher with vacuum chuck
LAM RES CORP9 citations84
US6518705B2Feb 11, 2003
Method and apparatus for producing uniform process rates
LAM RES CORP16 citations84
US9982341B2May 29, 2018
Modular vaporizer
LAM RES CORP7 citations83
US7662254B2Feb 16, 2010
Methods of and apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer
LAM RES CORP8 citations82
US8898928B2Dec 2, 2014
Delamination drying apparatus and method
LAM RES CORP18 citations81
US6653791B1Nov 25, 2003
Method and apparatus for producing uniform process rates
LAM RES CORP10 citations74
US11984330B2May 14, 2024
Atomic layer etch and deposition processing systems including a lens circuit with a tele-centric lens, an optical beam folding assembly, or a polygon scanner
LAM RES CORP2 citations70
US7922866B2Apr 12, 2011
Apparatus for aligning electrodes in a process chamber to protect an exclusion area within an edge environ of a wafer
LAM RES CORP4 citations60
US9287110B2Mar 15, 2016
Method and apparatus for wafer electroless plating
LAM RES CORP0 citations51
US10107490B2Oct 23, 2018
Configurable liquid precursor vaporizer
LAM RES CORP0 citations39
THIE WILLIAM
4 patentsUS8314027B2Nov 20, 2012
Wafer electroless plating system and associated methods
THIE WILLIAM2 citations60
US8485120B2Jul 16, 2013
Method and apparatus for wafer electroless plating
THIE WILLIAM1 citations50
US8069813B2Dec 6, 2011
Wafer electroless plating system and associated methods
THIE WILLIAM1 citations50
US8844461B2Sep 30, 2014
Fluid handling system for wafer electroless plating and associated methods
THIE WILLIAM0 citations39