Inventor
BUESE DENNIS
US5 patents
Patents
5 patentsUS6257954B1Jul 10, 2001
Apparatus and process for high temperature wafer edge polishing
MEMC ELECTRONIC MATERIALS27 citations90
US6479386B1Nov 12, 2002
Process for reducing surface variations for polished wafer
MEMC ELECTRONIC MATERIALS22 citations85
US7846006B2Dec 7, 2010
Dressing a wafer polishing pad
MEMC ELECTRONIC MATERIALS3 citations57
US7846007B2Dec 7, 2010
System and method for dressing a wafer polishing pad
MEMC ELECTRONIC MATERIALS3 citations57
US6398631B1Jun 4, 2002
Method and apparatus to place wafers into and out of machine
MEMC ELECTRONIC MATERIALS2 citations54