Inventor
NOFEN ELIZABETH
US9 patents
⚠️ This page may combine multiple inventors who share the name “NOFEN ELIZABETH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
5 patentsUS12417958B2Sep 16, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone
INTEL CORP0 citations59
US12347743B2Jul 1, 2025
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone
INTEL CORP0 citations59
US12315777B2May 27, 2025
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone
INTEL CORP0 citations59
US11676876B2Jun 13, 2023
Semiconductor die package with warpage management and process for forming such
INTEL CORP0 citations57
US11562940B2Jan 24, 2023
Integrated heat spreader comprising a silver and sintering silver layered structure
INTEL CORP0 citations46
DAI LENORE
3 patentsUS12258439B2Mar 25, 2025
Mechanophore-grafted polymers to form stress-responsive thermoset network
DAI LENORE0 citations55
US11753498B2Sep 12, 2023
Mechanophore-grafted polymers to form stress-responsive thermoset network
DAI LENORE0 citations55
US11034791B2Jun 15, 2021
Mechanophore-grafted polymers to form stress-responsive thermoset network
DAI LENORE0 citations55