Inventor

LEAL JEFFREY S

US9 patents

⚠️ This page may combine multiple inventors who share the name “LEAL JEFFREY S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INVENSAS CORP

3 patents

US9196588B2Nov 24, 2015

EMI shield

INVENSAS CORP44 citations92

US9508689B2Nov 29, 2016

Electrical connector between die pad and z-interconnect for stacked die assemblies

INVENSAS CORP2 citations58

US9490230B2Nov 8, 2016

Selective die electrical insulation by additive process

INVENSAS CORP0 citations50

CO REYNALDO

2 patents

US8680687B2Mar 25, 2014

Electrical interconnect for die stacked in zig-zag configuration

CO REYNALDO7 citations81

US9153517B2Oct 6, 2015

Electrical connector between die pad and z-interconnect for stacked die assemblies

CO REYNALDO5 citations79

MCGRATH SCOTT

1 patent

US8912661B2Dec 16, 2014

Stacked die assembly having reduced stress electrical interconnects

MCGRATH SCOTT5 citations65

ANDREWS JR LAWRENCE DOUGLAS

1 patent

US8159053B2Apr 17, 2012

Flat leadless packages and stacked leadless package assemblies

ANDREWS JR LAWRENCE DOUGLAS4 citations56

LEAL JEFFREY S

1 patent

US9147583B2Sep 29, 2015

Selective die electrical insulation by additive process

LEAL JEFFREY S2 citations54

BARRIE KEITH LAKE

1 patent

US8829677B2Sep 9, 2014

Semiconductor die having fine pitch electrical interconnects

BARRIE KEITH LAKE0 citations39