Inventor
CHANG CHIA-AO
TW9 patents
Patents
9 patentsUS10504747B2Dec 10, 2019
Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12087845B2Sep 10, 2024
System and methods of manufacturing semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11710777B2Jul 25, 2023
Semiconductor device and method for manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11211470B2Dec 28, 2021
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11205709B2Dec 21, 2021
Defect filling in patterned layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12183590B2Dec 31, 2024
Method of performing gap filling including filling trenches between dummy gate stacks on semiconductor fins/strips with semiconductor material
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11605543B2Mar 14, 2023
Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11289343B2Mar 29, 2022
Method of gap filling using conformal deposition-annealing-etching cycle for reducing seam void and bending
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10115639B2Oct 30, 2018
FinFET device and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations42