Inventor
BERNARDONI LONNIE L
US9 patents
Patents
9 patentsUS5355016AOct 11, 1994
Shielded EPROM package
MOTOROLA INC225 citations98
US5172303ADec 15, 1992
Electronic component assembly
MOTOROLA INC184 citations98
US5218759AJun 15, 1993
Method of making a transfer molded semiconductor device
MOTOROLA INC140 citations97
US5278726AJan 11, 1994
Method and apparatus for partially overmolded integrated circuit package
MOTOROLA INC105 citations96
US5153385AOct 6, 1992
Transfer molded semiconductor package with improved adhesion
MOTOROLA INC62 citations96
US5153379AOct 6, 1992
Shielded low-profile electronic component assembly
MOTOROLA INC133 citations94
US5457610AOct 10, 1995
Low profile mechanical interconnect system having metalized loop and hoop area
MOTOROLA INC32 citations92
US5172852ADec 22, 1992
Soldering method
MOTOROLA INC36 citations92
US5369880ADec 6, 1994
Method for forming solder deposit on a substrate
MOTOROLA INC14 citations68