Inventor

PARK SANG WOOK

KR185 patents

⚠️ This page may combine multiple inventors who share the name “PARK SANG WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK SANG WOOK

SAMSUNG ELECTRONICS CO LTD

Physically unclonable function circuit, and system and integrated circuit including the same

Semiconductor module with vertically mounted semiconductor chip packages

Semiconductor device having trench isolation structure and method of fabricating the same

Semiconductor device having trench isolation structure and method of fabricating the same

Semiconductor module with heat sink and method thereof

Semiconductor chip package with thermoelectric cooler

Silicon on insulator device having trench isolation layer and method for manufacturing the same

Integrated circuit package and integrated circuit module

Integrated circuit for physically unclonable function and device including the same

Semiconductor packages including a heat spreader and methods of forming the same

Stack package of ball grid array type

Packaged semiconductor die and manufacturing method thereof

Semiconductor stack package and memory module with improved heat dissipation

HYNIX SEMICONDUCTOR INC

Method of manufacturing a semiconductor device by RTA process in nitrogen atmosphere

Ball grid array IC package and manufacturing method thereof

Method of manufacturing a flash memory cell

System of performing a repair analysis for a semiconductor memory device having a redundant architecture

Apparatus and method for duty cycle correction

Method of manufacturing flash memory device

Method for manufacturing semiconductor device

Method of forming an isolation film in a semiconductor device

Method of manufacturing flash memory

Method for forming isolation layer in semiconductor device

Method for fabricating semiconductor device

Method of manufacturing flash memory device

HYUNDAI ELECTRONICS IND

Stack package and method of fabricating the same

Chip size stack package, memory module having the same, and method of fabricating the module

Chip size stack package and method of fabricating the same

Chip size stack package and method of fabricating the same

Chip stack package

Chip size package and method of fabricating the same

Method of manufacturing semiconductor device

Method of manufacturing a semiconductor device

SAMSUNG SDI CO LTD

Textured semiconductor wafer for solar cell

Solar cell, uneven surface on an insulation layer as a screen mesh pattern, and manufacturing method thereof

PARK SANG WOOK

Circuit for detecting a voltage change using a time-to-digital converter

Controller, and patch type automated external defibrillator for controlling defibrillation using the same

APPLIED MATERIALS INC

Cryogenic atomic layer etch with noble gases

Cryogenic atomic layer etch with noble gases

CHEIL JEDANG CORP

1H-indole derivatives as a highly selective cyclooxygenase-2 inhibitor

PARK SANG-WOOK

Wafer level package and methods of fabricating the same

LG DISPLAY CO LTD

Method for fabricating a thin film transistor for use with a flat panel display device

KT FREETEL CO LTD

System and method for supervising repeater by using wireless mobile

LEE JU-HWAN

Image display apparatus and method

LEE DAI-GIL

Liquid tight sealing of heat-insulating walls of a liquefied natural gas carrier

CJ CORP

1,2,4-Triazole derivative, method for preparing the same, and pharmaceutical composition containing the same

CHANG SUNG SOO

Liquid crystal display device capable of compensatng for a resistance variation in a link unit

SONG IN-SANG

Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure

ELECTRONICS & TELECOMMUNICATIONS RES INST

Experience ride representation apparatus and method for real-sense media service based on multi-vision

SAMSUNG ELECTRO MECH

Stack type surface acoustic wave package, and method for manufacturing the same