Inventor
MENDELSON RONALD L
US10 patents
⚠️ This page may combine multiple inventors who share the name “MENDELSON RONALD L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS6271102B1Aug 7, 2001
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM125 citations98
US6368881B1Apr 9, 2002
Wafer thickness control during backside grind
IBM54 citations96
US6915795B2Jul 12, 2005
Method and system for dicing wafers, and semiconductor structures incorporating the products thereof
IBM20 citations92
US6887126B2May 3, 2005
Wafer thickness control during backside grind
IBM25 citations92
US6806578B2Oct 19, 2004
Copper pad structure
IBM32 citations92
US6153536ANov 28, 2000
Method for mounting wafer frame at back side grinding (BSG) tool
IBM42 citations92
US6222145B1Apr 24, 2001
Mechanical strength die sorting
IBM22 citations89
US6600213B2Jul 29, 2003
Semiconductor structure and package including a chip having chamfered edges
IBM7 citations73
US7134933B2Nov 14, 2006
Wafer thickness control during backside grind
IBM0 citations52