Inventor

SUGA TADATOMO

JP42 patents

⚠️ This page may combine multiple inventors who share the name “SUGA TADATOMO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SUGA TADATOMO

SUGA TADATOMO

Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer

Substrate bonding apparatus and substrate bonding method

Joining method and device produced by this method and joining unit

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Bonding-substrate fabrication method, bonding substrate, substrate bonding method, bonding-substrate fabrication apparatus, and substrate assembly

Substrate bonding apparatus and substrate bonding method

Device for bonding a metal on a surface of a substrate

Method for bonding polymer film and polymer film, method for bonding polymer film and inorganic material substrate, polymer film laminate, and laminate of polymer film and inorganic material substrate

Joining method and device produced by this method and joining unit

TOKYO ELECTRON LTD

Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object

Inspection method and inspection apparatus

Inspection method and inspection apparatus

Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object

Inspection apparatus to break the oxide of an electrode by fritting phenomenon

Inspection method and inspection apparatus

BONDTECH CO LTD

Substrate bonding method and substrate bonding system

Bonding system and bonding method

Bonding system and bonding method

Substrate joining method, substrate joining system and method for controlling hydrophilic treatment device

RENESAS TECH CORP

Semiconductor device and process for manufacturing the same

Circuit structure and semiconductor integrated circuit

Semiconductor device and process for manufacturing the same

OKI ELECTRIC IND CO LTD

Method for manufacturing an interconnect structure for stacked semiconductor device

Interconnect structure for stacked semiconductor device

ROHM CO LTD

Semiconductor device and method for fabricating the device

Method of mounting an electronic part

ALPHA DESIGN CO LTD

Electronic component bonding method

Element pressing apparatus and heating system using element pressing apparatus

ISABERS JAPAN CO LTD

Method for bonding substrate, transparent substrate laminate, and device provided with substrate laminate

Method for joining transparent substrates

LAN TECHNICAL SERVICE CO LTD

Thin substrate, method for manufacturing same, and method for transporting substrate

Electronic element sealing method and bonded substrate

SENJU METAL INDUSTRY CO

Residue-free solder paste

TOYO KOHAN CO LTD

Semiconductor device and fabrication method therefor

SHINKO SEIKI

Reflow soldering method

AYUMI INDUSTRY CO LTD

Method for bonding substrates and method for irradiating particle beam to be utilized therefor

BONDTECH INC

Joining method and device produced by this method and joining unit

AYUMI INDUSTRY

Method for bonding substrates and device for bonding substrates

SHARP KK

High-reliable semiconductor device using hermetic sealing of electrodes

MIYAZAWA KUN ICHI

Fullerene hollow structure needle crystal and C60-C70 mixed fine wire, and method for preparation thereof

NAT INST FOR MATERIAL SCIENCE

Fullerene derivative fine wire and its manufacturing method

DENSO CORP

Joint structure, electronic device and method for manufacturing the joint structure