Inventor
YUAN TSORNG-DIH
US16 patents
⚠️ This page may combine multiple inventors who share the name “YUAN TSORNG-DIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
9 patentsUS6337513B1Jan 8, 2002
Chip packaging system and method using deposited diamond film
IBM188 citations99
US7052937B2May 30, 2006
Method and structure for providing improved thermal conduction for silicon semiconductor devices
IBM64 citations98
US5366923ANov 22, 1994
Bonded wafer structure having a buried insulation layer
IBM54 citations96
US5276338AJan 4, 1994
Bonded wafer structure having a buried insulation layer
IBM68 citations95
US6617702B2Sep 9, 2003
Semiconductor device utilizing alignment marks for globally aligning the front and back sides of a semiconductor substrate
IBM33 citations93
US6778393B2Aug 17, 2004
Cooling device with multiple compliant elements
IBM48 citations92
US6579743B2Jun 17, 2003
Chip packaging system and method using deposited diamond film
IBM15 citations92
US7134484B2Nov 14, 2006
Increased efficiency in liquid and gaseous planar device cooling technology
IBM14 citations84
US7329600B2Feb 12, 2008
Low dielectric semiconductor device and process for fabricating the same
IBM1 citations52
TAIWAN SEMICONDUCTOR MFG
5 patentsUS7514775B2Apr 7, 2009
Stacked structures and methods of fabricating stacked structures
TAIWAN SEMICONDUCTOR MFG24 citations92
US7361986B2Apr 22, 2008
Heat stud for stacked chip package
TAIWAN SEMICONDUCTOR MFG28 citations92
US7135769B2Nov 14, 2006
Semiconductor packages and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG12 citations84
US7138300B2Nov 21, 2006
Structural design for flip-chip assembly
TAIWAN SEMICONDUCTOR MFG3 citations63
US7348218B2Mar 25, 2008
Semiconductor packages and methods of manufacturing thereof
TAIWAN SEMICONDUCTOR MFG4 citations62