Inventor
MIYAJI MASAYUKI
JP17 patents
⚠️ This page may combine multiple inventors who share the name “MIYAJI MASAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
13 patentsUS6326845B1Dec 4, 2001
Feedforward amplifier
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD63 citations96
US6201439B1Mar 13, 2001
Power splitter/ combiner circuit, high power amplifier and balun circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD44 citations96
US5973557AOct 26, 1999
High efficiency linear power amplifier of plural frequency bands and high efficiency power amplifier
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD86 citations95
US6847258B2Jan 25, 2005
Power amplifier, power amplifying method and radio communication apparatus
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD52 citations92
US6803837B2Oct 12, 2004
Power splitter/combiner circuit, high power amplifier and balun circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD18 citations92
US6545542B2Apr 8, 2003
Power amplifier with coupler for cross-coupling amplifiers for reduction of differential frequency component
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD37 citations92
US6710652B2Mar 23, 2004
Feedforward amplifier
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD15 citations84
US6590906B1Jul 8, 2003
Multi-carrier transmitter circuit and communication equipment
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD19 citations84
US6690249B2Feb 10, 2004
Power splitter/combiner multi-layer circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD4 citations73
US6563395B2May 13, 2003
Power splitter/combiner circuit, high power amplifier and balun circuit
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations73
US6300848B1Oct 9, 2001
Power splitter and power combiner using N-branch-line-shaped directional couplers
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD14 citations73
US6037837AMar 14, 2000
Feed forward amplifier
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD13 citations73
US6940346B2Sep 6, 2005
Feedforward amplifier, communication apparatus, feedforward amplification method, program and medium
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5 citations63
SHOWA DENKO MATERIALS CO LTD
4 patentsUS12246398B2Mar 11, 2025
Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump
SHOWA DENKO MATERIALS CO LTD1 citations59
US12172240B2Dec 24, 2024
Solder particles
SHOWA DENKO MATERIALS CO LTD0 citations58
US12100923B2Sep 24, 2024
Connection structure and manufacturing method therefor
SHOWA DENKO MATERIALS CO LTD0 citations56
US12247270B2Mar 11, 2025
Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses
SHOWA DENKO MATERIALS CO LTD0 citations47