Inventor
ADETUTU OLUBUNMI O
US49 patents
⚠️ This page may combine multiple inventors who share the name “ADETUTU OLUBUNMI O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
38 patentsUS6897095B1May 24, 2005
Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode
FREESCALE SEMICONDUCTOR INC132 citations98
US7132360B2Nov 7, 2006
Method for treating a semiconductor surface to form a metal-containing layer
FREESCALE SEMICONDUCTOR INC590 citations97
US6902969B2Jun 7, 2005
Process for forming dual metal gate structures
FREESCALE SEMICONDUCTOR INC78 citations97
US7144825B2Dec 5, 2006
Multi-layer dielectric containing diffusion barrier material
FREESCALE SEMICONDUCTOR INC55 citations95
US7109079B2Sep 19, 2006
Metal gate transistor CMOS process and method for making
FREESCALE SEMICONDUCTOR INC71 citations95
US7015153B1Mar 21, 2006
Method for forming a layer using a purging gas in a semiconductor process
FREESCALE SEMICONDUCTOR INC56 citations95
US6790719B1Sep 14, 2004
Process for forming dual metal gate structures
FREESCALE SEMICONDUCTOR INC60 citations94
US7524707B2Apr 28, 2009
Modified hybrid orientation technology
FREESCALE SEMICONDUCTOR INC19 citations93
US7288458B2Oct 30, 2007
SOI active layer with different surface orientation
FREESCALE SEMICONDUCTOR INC21 citations93
US7074664B1Jul 11, 2006
Dual metal gate electrode semiconductor fabrication process and structure thereof
FREESCALE SEMICONDUCTOR INC49 citations93
US7037795B1May 2, 2006
Low RC product transistors in SOI semiconductor process
FREESCALE SEMICONDUCTOR INC26 citations93
US7030001B2Apr 18, 2006
Method for forming a gate electrode having a metal
FREESCALE SEMICONDUCTOR INC31 citations91
US7981808B2Jul 19, 2011
Method of forming a gate dielectric by in-situ plasma
FREESCALE SEMICONDUCTOR INC8 citations84
US7579282B2Aug 25, 2009
Method for removing metal foot during high-k dielectric/metal gate etching
FREESCALE SEMICONDUCTOR INC11 citations84
US7297586B2Nov 20, 2007
Gate dielectric and metal gate integration
FREESCALE SEMICONDUCTOR INC13 citations84
US7045432B2May 16, 2006
Method for forming a semiconductor device with local semiconductor-on-insulator (SOI)
FREESCALE SEMICONDUCTOR INC14 citations84
US7402472B2Jul 22, 2008
Method of making a nitrided gate dielectric
FREESCALE SEMICONDUCTOR INC9 citations83
US7651935B2Jan 26, 2010
Process of forming an electronic device including active regions and gate electrodes of different compositions overlying the active regions
FREESCALE SEMICONDUCTOR INC10 citations82
US7442621B2Oct 28, 2008
Semiconductor process for forming stress absorbent shallow trench isolation structures
FREESCALE SEMICONDUCTOR INC10 citations82
US7544575B2Jun 9, 2009
Dual metal silicide scheme using a dual spacer process
FREESCALE SEMICONDUCTOR INC12 citations81
US7811891B2Oct 12, 2010
Method to control the gate sidewall profile by graded material composition
FREESCALE SEMICONDUCTOR INC17 citations80
US7297588B2Nov 20, 2007
Electronic device comprising a gate electrode including a metal-containing layer having one or more impurities and a process for forming the same
FREESCALE SEMICONDUCTOR INC7 citations73
US7235502B2Jun 26, 2007
Transitional dielectric layer to improve reliability and performance of high dielectric constant transistors
FREESCALE SEMICONDUCTOR INC8 citations72
US7071038B2Jul 4, 2006
Method of forming a semiconductor device having a dielectric layer with high dielectric constant
FREESCALE SEMICONDUCTOR INC10 citations71
US7618902B2Nov 17, 2009
Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer
FREESCALE SEMICONDUCTOR INC4 citations63
US7303983B2Dec 4, 2007
ALD gate electrode
FREESCALE SEMICONDUCTOR INC6 citations63
US7179700B2Feb 20, 2007
Semiconductor device with low resistance contacts
FREESCALE SEMICONDUCTOR INC5 citations63
US7001852B2Feb 21, 2006
Method of making a high quality thin dielectric layer
FREESCALE SEMICONDUCTOR INC2 citations63
US6987063B2Jan 17, 2006
Method to reduce impurity elements during semiconductor film deposition
FREESCALE SEMICONDUCTOR INC3 citations63
US7868389B2Jan 11, 2011
Electronic device comprising a gate electrode including a metal-containing layer having one or more impurities
FREESCALE SEMICONDUCTOR INC2 citations62
US7432164B2Oct 7, 2008
Semiconductor device comprising a transistor having a counter-doped channel region and method for forming the same
FREESCALE SEMICONDUCTOR INC6 citations62
US6908852B2Jun 21, 2005
Method of forming an arc layer for a semiconductor device
FREESCALE SEMICONDUCTOR INC4 citations54
US8030220B2Oct 4, 2011
Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer
FREESCALE SEMICONDUCTOR INC0 citations52
US7704821B2Apr 27, 2010
In-situ nitridation of high-k dielectrics
FREESCALE SEMICONDUCTOR INC0 citations52
US6933227B2Aug 23, 2005
Semiconductor device and method of forming the same
FREESCALE SEMICONDUCTOR INC1 citations52
US6881681B2Apr 19, 2005
Film deposition on a semiconductor wafer
FREESCALE SEMICONDUCTOR INC1 citations48
US7435646B2Oct 14, 2008
Method for forming floating gates within NVM process
FREESCALE SEMICONDUCTOR INC0 citations42
US7745298B2Jun 29, 2010
Method of forming a via
FREESCALE SEMICONDUCTOR INC0 citations41
MOTOROLA INC
6 patentsUS6184072B1Feb 6, 2001
Process for forming a high-K gate dielectric
MOTOROLA INC224 citations98
US6369430B1Apr 9, 2002
Method of preventing two neighboring contacts from a short-circuit caused by a void between them and device having the same
MOTOROLA INC121 citations97
US6849487B2Feb 1, 2005
Method for forming an electronic structure using etch
MOTOROLA INC93 citations96
US6423619B1Jul 23, 2002
Transistor metal gate structure that minimizes non-planarity effects and method of formation
MOTOROLA INC154 citations95
US6255204B1Jul 3, 2001
Method for forming a semiconductor device
MOTOROLA INC31 citations92
US6686282B1Feb 3, 2004
Plated metal transistor gate and method of formation
MOTOROLA INC30 citations88
ADETUTU OLUBUNMI O
4 patentsUS8426310B2Apr 23, 2013
Method of forming a shared contact in a semiconductor device
ADETUTU OLUBUNMI O6 citations72
US8125032B2Feb 28, 2012
Modified hybrid orientation technology
ADETUTU OLUBUNMI O5 citations72
US8659087B2Feb 25, 2014
Electronic device with a gate electrode having at least two portions
ADETUTU OLUBUNMI O0 citations49
US8435898B2May 7, 2013
First inter-layer dielectric stack for non-volatile memory
ADETUTU OLUBUNMI O0 citations35