P

Inventor

ADETUTU OLUBUNMI O

US49 patents
⚠️ This page may combine multiple inventors who share the name “ADETUTU OLUBUNMI O”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FREESCALE SEMICONDUCTOR INC

38 patents
US6897095B1May 24, 2005

Semiconductor process and integrated circuit having dual metal oxide gate dielectric with single metal gate electrode

FREESCALE SEMICONDUCTOR INC132 citations98
US7132360B2Nov 7, 2006

Method for treating a semiconductor surface to form a metal-containing layer

FREESCALE SEMICONDUCTOR INC590 citations97
US6902969B2Jun 7, 2005

Process for forming dual metal gate structures

FREESCALE SEMICONDUCTOR INC78 citations97
US7144825B2Dec 5, 2006

Multi-layer dielectric containing diffusion barrier material

FREESCALE SEMICONDUCTOR INC55 citations95
US7109079B2Sep 19, 2006

Metal gate transistor CMOS process and method for making

FREESCALE SEMICONDUCTOR INC71 citations95
US7015153B1Mar 21, 2006

Method for forming a layer using a purging gas in a semiconductor process

FREESCALE SEMICONDUCTOR INC56 citations95
US6790719B1Sep 14, 2004

Process for forming dual metal gate structures

FREESCALE SEMICONDUCTOR INC60 citations94
US7524707B2Apr 28, 2009

Modified hybrid orientation technology

FREESCALE SEMICONDUCTOR INC19 citations93
US7288458B2Oct 30, 2007

SOI active layer with different surface orientation

FREESCALE SEMICONDUCTOR INC21 citations93
US7074664B1Jul 11, 2006

Dual metal gate electrode semiconductor fabrication process and structure thereof

FREESCALE SEMICONDUCTOR INC49 citations93
US7037795B1May 2, 2006

Low RC product transistors in SOI semiconductor process

FREESCALE SEMICONDUCTOR INC26 citations93
US7030001B2Apr 18, 2006

Method for forming a gate electrode having a metal

FREESCALE SEMICONDUCTOR INC31 citations91
US7981808B2Jul 19, 2011

Method of forming a gate dielectric by in-situ plasma

FREESCALE SEMICONDUCTOR INC8 citations84
US7579282B2Aug 25, 2009

Method for removing metal foot during high-k dielectric/metal gate etching

FREESCALE SEMICONDUCTOR INC11 citations84
US7297586B2Nov 20, 2007

Gate dielectric and metal gate integration

FREESCALE SEMICONDUCTOR INC13 citations84
US7045432B2May 16, 2006

Method for forming a semiconductor device with local semiconductor-on-insulator (SOI)

FREESCALE SEMICONDUCTOR INC14 citations84
US7402472B2Jul 22, 2008

Method of making a nitrided gate dielectric

FREESCALE SEMICONDUCTOR INC9 citations83
US7651935B2Jan 26, 2010

Process of forming an electronic device including active regions and gate electrodes of different compositions overlying the active regions

FREESCALE SEMICONDUCTOR INC10 citations82
US7442621B2Oct 28, 2008

Semiconductor process for forming stress absorbent shallow trench isolation structures

FREESCALE SEMICONDUCTOR INC10 citations82
US7544575B2Jun 9, 2009

Dual metal silicide scheme using a dual spacer process

FREESCALE SEMICONDUCTOR INC12 citations81
US7811891B2Oct 12, 2010

Method to control the gate sidewall profile by graded material composition

FREESCALE SEMICONDUCTOR INC17 citations80
US7297588B2Nov 20, 2007

Electronic device comprising a gate electrode including a metal-containing layer having one or more impurities and a process for forming the same

FREESCALE SEMICONDUCTOR INC7 citations73
US7235502B2Jun 26, 2007

Transitional dielectric layer to improve reliability and performance of high dielectric constant transistors

FREESCALE SEMICONDUCTOR INC8 citations72
US7071038B2Jul 4, 2006

Method of forming a semiconductor device having a dielectric layer with high dielectric constant

FREESCALE SEMICONDUCTOR INC10 citations71
US7618902B2Nov 17, 2009

Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer

FREESCALE SEMICONDUCTOR INC4 citations63
US7303983B2Dec 4, 2007

ALD gate electrode

FREESCALE SEMICONDUCTOR INC6 citations63
US7179700B2Feb 20, 2007

Semiconductor device with low resistance contacts

FREESCALE SEMICONDUCTOR INC5 citations63
US7001852B2Feb 21, 2006

Method of making a high quality thin dielectric layer

FREESCALE SEMICONDUCTOR INC2 citations63
US6987063B2Jan 17, 2006

Method to reduce impurity elements during semiconductor film deposition

FREESCALE SEMICONDUCTOR INC3 citations63
US7868389B2Jan 11, 2011

Electronic device comprising a gate electrode including a metal-containing layer having one or more impurities

FREESCALE SEMICONDUCTOR INC2 citations62
US7432164B2Oct 7, 2008

Semiconductor device comprising a transistor having a counter-doped channel region and method for forming the same

FREESCALE SEMICONDUCTOR INC6 citations62
US6908852B2Jun 21, 2005

Method of forming an arc layer for a semiconductor device

FREESCALE SEMICONDUCTOR INC4 citations54
US8030220B2Oct 4, 2011

Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer

FREESCALE SEMICONDUCTOR INC0 citations52
US7704821B2Apr 27, 2010

In-situ nitridation of high-k dielectrics

FREESCALE SEMICONDUCTOR INC0 citations52
US6933227B2Aug 23, 2005

Semiconductor device and method of forming the same

FREESCALE SEMICONDUCTOR INC1 citations52
US6881681B2Apr 19, 2005

Film deposition on a semiconductor wafer

FREESCALE SEMICONDUCTOR INC1 citations48
US7435646B2Oct 14, 2008

Method for forming floating gates within NVM process

FREESCALE SEMICONDUCTOR INC0 citations42
US7745298B2Jun 29, 2010

Method of forming a via

FREESCALE SEMICONDUCTOR INC0 citations41

MOTOROLA INC

6 patents

ADETUTU OLUBUNMI O

4 patents

TRIYOSO DINA H

1 patent