P

Inventor

NI TUQIANG

US62 patents
⚠️ This page may combine multiple inventors who share the name “NI TUQIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

25 patents
US6527911B1Mar 4, 2003

Configurable plasma volume etch chamber

LAM RES CORP218 citations99
US9190302B2Nov 17, 2015

System and method for controlling plasma with an adjustable coupling to ground circuit

LAM RES CORP154 citations98
US6461974B1Oct 8, 2002

High temperature tungsten etching process

LAM RES CORP226 citations98
US6230651B1May 15, 2001

Gas injection system for plasma processing

LAM RES CORP111 citations98
US6746961B2Jun 8, 2004

Plasma etching of dielectric layer with etch profile control

LAM RES CORP61 citations96
US6257168B1Jul 10, 2001

Elevated stationary uniformity ring design

LAM RES CORP57 citations96
US6062729AMay 16, 2000

Rapid IR transmission thermometry for wafer temperature sensing

LAM RES CORP55 citations96
US8025731B2Sep 27, 2011

Gas injection system for plasma processing

LAM RES CORP24 citations92
US7785417B2Aug 31, 2010

Gas injection system for plasma processing

LAM RES CORP35 citations92
US6716303B1Apr 6, 2004

Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same

LAM RES CORP20 citations92
US6709547B1Mar 23, 2004

Moveable barrier for multiple etch processes

LAM RES CORP50 citations92
US6514378B1Feb 4, 2003

Method for improving uniformity and reducing etch rate variation of etching polysilicon

LAM RES CORP36 citations92
US6388383B1May 14, 2002

Method of an apparatus for obtaining neutral dissociated gas atoms

LAM RES CORP28 citations92
US6052176AApr 18, 2000

Processing chamber with optical window cleaned using process gas

LAM RES CORP32 citations92
US6526355B1Feb 25, 2003

Integrated full wavelength spectrometer for wafer processing

LAM RES CORP23 citations91
US6617257B2Sep 9, 2003

Method of plasma etching organic antireflective coating

LAM RES CORP35 citations89
US6622286B1Sep 16, 2003

Integrated electronic hardware for wafer processing control and diagnostic

LAM RES CORP20 citations87
US6503766B1Jan 7, 2003

Method and system for detecting an exposure of a material on a semiconductor wafer during chemical-mechanical polishing

LAM RES CORP15 citations84
US6855567B1Feb 15, 2005

Etch endpoint detection

LAM RES CORP13 citations83
US6531029B1Mar 11, 2003

Vacuum plasma processor apparatus and method

LAM RES CORP15 citations83
US6465159B1Oct 15, 2002

Method and apparatus for side wall passivation for organic etch

LAM RES CORP14 citations81
US7077971B2Jul 18, 2006

Methods for detecting the endpoint of a photoresist stripping process

LAM RES CORP2 citations62
US7105102B2Sep 12, 2006

Vacuum plasma processor having a chamber with electrodes and a coil for plasma excitation and method of operating same

LAM RES CORP0 citations52
US6451158B1Sep 17, 2002

Apparatus for detecting the endpoint of a photoresist stripping process

LAM RES CORP1 citations52
US6897156B2May 24, 2005

Vacuum plasma processor method

LAM RES CORP1 citations51

ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA

9 patents

ADVANCED MICRO FAB EQUIP INC

4 patents

NI TUQIANG

4 patents

ADVANCED MICRO FABRICATION EQUIPMENT INC SHANGHAI

3 patents

ADVANCED MICRO-FABRICATION EQUIPMENT INC SHANGHAI

2 patents

LAM CORP

1 patent

CHEN AIHUA

1 patent

YIN GERALD

1 patent

Showing the top 50 of 62 patents by PatentIndex Score.