Inventor
LIU CHUNG-HSIEN
TW12 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHUNG-HSIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
WINBOND ELECTRONICS CORP
9 patentsUS12402361B2Aug 26, 2025
Semiconductor structure and method for forming the same
WINBOND ELECTRONICS CORP2 citations72
US10847612B2Nov 24, 2020
Method of manufacturing memory structure
WINBOND ELECTRONICS CORP2 citations71
US10566337B2Feb 18, 2020
Method of manufacturing memory device
WINBOND ELECTRONICS CORP3 citations71
US10418440B2Sep 17, 2019
Memory structure
WINBOND ELECTRONICS CORP3 citations71
US12527037B2Jan 13, 2026
Semiconductor device with floating gate, and method for manufacturing the same
WINBOND ELECTRONICS CORP0 citations59
US12119261B2Oct 15, 2024
Semiconductor structure and manufacturing method of the same
WINBOND ELECTRONICS CORP0 citations49
US12176440B2Dec 24, 2024
Semiconductor structure with an air gap and method of forming the same
WINBOND ELECTRONICS CORP0 citations45
US10497786B2Dec 3, 2019
Manufacturing method of semiconductor device
WINBOND ELECTRONICS CORP0 citations40
US10381449B2Aug 13, 2019
Method of manufacturing memory device
WINBOND ELECTRONICS CORP0 citations40