Inventor

WONG YAM MO

SG21 patents

⚠️ This page may combine multiple inventors who share the name “WONG YAM MO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WONG YAM MO

ASM TECH SINGAPORE PTE LTD

Wire bonding method for forming low-loop profiles

Electronic device handler for a bonding apparatus

Apparatus and method to prevent oxidation of electronic devices

Apparatus for detecting the oscillation amplitude of an oscillating object

Vacuum wire tensioner for wire bonder

Apparatus for delivering shielding gas during wire bonding

Electronic device handler for a bonding apparatus

Bondhead for wire bonding apparatus

Method of fabricating a wire bond with multiple stitch bonds

Multiple-head wire-bonding system

Multiple-ball wire bonds

Method of bonding wires

Method of forming low wire loops and wire loops formed using the method

Bonding system

Capillary holder

Wire bond with improved shear strength

Apparatus for testing multiple semiconductor dice with increased throughput

Flanged transducer having improved rigidity

Stud bumping apparatus

WONG YAM MO

Wire bonder including a transducer, a bond head, and a mounting apparatus

ASM TECHNOLOGY SINGAPORE PTE

Method of and apparatus for monitoring a ball forming process