Inventor

UEKI HIROSHI

JP53 patents

⚠️ This page may combine multiple inventors who share the name “UEKI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UEKI HIROSHI

DOW CORNING TORAY SILICONE

Resin additive, curable resin composition, and cured resin

Thermoplastic resin composition and moldings therefrom

Silicone-containing polyimide resin, silicon-containing polyamic acid, and methods for manufacture

Method for the preparation of organofunctional organopentasiloxane, organic resin modifier and organic resins

Flame-retardant polyolefin-type resin composition, method for the preparation thereof, and flame retardant cables

Hydroxyphenyl-containing polyorganosiloxanes

Thermoplastic resin composition

Curable epoxy resin composition

Silicon-containing polyimide resin and silicon-containing polyamic acid

Flame-retardant thermoplastic resin composition and manufacturing method thereof

Flame retardant organic resin composition

MURATA MANUFACTURING CO

Coil component

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Common-mode choke coil

Laminated coil component

NIPPON THOMPSON CO LTD

Linear motion guide unit

Revolving nozzle with fluid leakage prevention device

Multi-slider single rail linear motion guide unit

Self-adjustable double linear motion guide unit assembly

Compound rolling guide unit

Stability enhanced linear motion guide unit

Shelled linear motion guide unit

DOW CORNING TORAY CO LTD

Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor device

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoter

Curing silicone composition and cured product thereof

Curable silicone composition and cured product thereof

Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxane

MORITA YOSHITSUGU

Curable silicone composition and cured product therefrom

Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotor

Curable silicone composition and cured product thereof

Curable epoxy resin composition and cured product thereof

MITSUBISHI ELECTRIC CORP

Non-volatile semiconductor storage apparatus

Non-volatile semiconductor storage apparatus

Microcomputer including download circuit controlling data download to plurality of memories

RENESAS ELECTRONICS CORP

Semiconductor device, electronic device and sensing method

Correlation operation circuit and semiconductor device

IDEMITSU KOSAN CO

Polycarbonate, and molding and electrophotographic photoreceptor prepared therefrom

DOW CORNING TORAY SILICON CO L

Silicone resin composition, curable resin composition, and curable resin

CASIO COMPUTER CO LTD

Scroll control for a table display

KURITA WATER IND LTD

Method for removing carbon scale

MINOLTA CO LTD

Binder carrier

DOW CORNING TORAY SILCONE CO L

Additive for organic resin and organic resin composition

IBM

LSI system capable of reading and writing at high speed

DOW TORAY CO LTD

Curable organopolysiloxane composition for forming films, and method for producing organopolysiloxane cured film