Inventor
HOMMEN HEIKO
DE7 patents
Patents
7 patentsUS6684124B2Jan 27, 2004
Method for controlling a processing device for a sequential processing of semiconductor wafers
INFINEON TECHNOLOGIES AG40 citations92
US7401549B2Jul 22, 2008
Arrangement for transferring information/structures to wafers
INFINEON TECHNOLOGIES AG10 citations77
US6979522B2Dec 27, 2005
Method for exposing at least one or at least two semiconductor wafers
INFINEON TECHNOLOGIES AG3 citations62
US7310129B2Dec 18, 2007
Method for carrying out a double or multiple exposure
INFINEON TECHNOLOGIES AG2 citations57
US7186484B2Mar 6, 2007
Method for determining the relative positional accuracy of two structure elements on a wafer
INFINEON TECHNOLOGIES AG3 citations55
US7245351B2Jul 17, 2007
Alignment mark for coarse alignment and fine alignment of a semiconductor wafer in an exposure tool
INFINEON TECHNOLOGIES AG3 citations52
US6896999B2May 24, 2005
Method of exposing a semiconductor wafer in an exposer
INFINEON TECHNOLOGIES AG0 citations38