Inventor

KANG SA-YOON

KR44 patents

⚠️ This page may combine multiple inventors who share the name “KANG SA-YOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KANG SA-YOON

SAMSUNG ELECTRONICS CO LTD

Chip scale package and method for manufacturing the same using a redistribution substrate

Chip scale packages and methods for manufacturing the chip scale packages at wafer level

Wafer level stack chip package and method for manufacturing same

method for manufacturing a semiconductor package

Semiconductor chip, chip stack package and manufacturing method

Chip scale package

Semiconductor chip, chip stack package and manufacturing method

Wafer level package and method for manufacturing the same

Wafer level package and method for manufacturing the same

Semiconductor package

Wafer level package and method for manufacturing the same

Tape circuit substrate with reduced size of base film

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Semiconductor chip and TAB package having the same

Display driver integrated circuit device, film, and module

Semiconductor chip and tab package having the same

Method for manufacturing tape wiring board

Low-cost flexible film package module and method of manufacturing the same

Chip scale packages manufactured at wafer level

Semiconductor devices with bonding pads having intermetal dielectric layer of hybrid configuration and methods of fabricating the same

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Image pickup device with non-molded DSP chip and manufacturing method

Semiconductor package

Tape circuit substrate with reduced size of base film

Tape circuit substrate and semiconductor apparatus employing the same

Semiconductor package and method for its manufacture

TAB package connecting host device element

Method for manufacturing tape wiring board

Tab package connecting host device element

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Circuit film with bump, film package using the same, and related fabrication methods

Tape circuit substrate and semicondutor chip package using the same

Bump formed on semiconductor device chip and method for manufacturing the bump

Semiconductor package

Method and apparatus for bonding a flexible printed circuit cable to an ink jet print head assembly

Reinforced bond-pad substructure and method for fabricating the same

Display driver integrated circuit device, film, and module

Semiconductor package film having reinforcing member and related display module

CHOI KYOUNG-SEI

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

Method for manufacturing tape wiring board

SAMSUNG ELECTORNICS CO LTD

Three-dimensional multi-chip package having chip selection pads and manufacturing method thereof

LEE SI-HOON

Chip on flexible printed circuit type semiconductor package