P

Inventor

KIM DONG-HAN

JP112 patents
⚠️ This page may combine multiple inventors who share the name “KIM DONG-HAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

31 patents
US10455514B2Oct 22, 2019

Method and device for transmitting signal in wireless communication system

SAMSUNG ELECTRONICS CO LTD7 citations84
US10142079B2Nov 27, 2018

Method and apparatus for managing contention window in wireless communication system

SAMSUNG ELECTRONICS CO LTD5 citations84
US7895458B2Feb 22, 2011

Power control apparatus and method thereof

SAMSUNG ELECTRONICS CO LTD19 citations84
US7763986B2Jul 27, 2010

Semiconductor chip, film substrate, and related semiconductor chip package

SAMSUNG ELECTRONICS CO LTD9 citations84
US7732933B2Jun 8, 2010

Semiconductor chip and TAB package having the same

SAMSUNG ELECTRONICS CO LTD15 citations84
US7329597B2Feb 12, 2008

Semiconductor chip and tab package having the same

SAMSUNG ELECTRONICS CO LTD14 citations84
US7257096B2Aug 14, 2007

Global system for mobile communication (GSM) and general packet radio service (GPRS) power ramping controller and associated power ramping method

SAMSUNG ELECTRONICS CO LTD16 citations84
US7109575B2Sep 19, 2006

Low-cost flexible film package module and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD15 citations84
US6853090B2Feb 8, 2005

TAB tape for semiconductor package

SAMSUNG ELECTRONICS CO LTD12 citations84
US11340332B2May 24, 2022

Method and apparatus for processing radar data

SAMSUNG ELECTRONICS CO LTD9 citations83
US7855895B2Dec 21, 2010

Universal PCB and smart card using the same

SAMSUNG ELECTRONICS CO LTD13 citations83
US7630209B2Dec 8, 2009

Universal PCB and smart card using the same

SAMSUNG ELECTRONICS CO LTD13 citations83
US9570400B2Feb 14, 2017

Semiconductor package

SAMSUNG ELECTRONICS CO LTD12 citations81
US7525181B2Apr 28, 2009

Tape wiring substrate and tape package using the same

SAMSUNG ELECTRONICS CO LTD6 citations74
US11637605B2Apr 25, 2023

Method and device for transmitting and receiving feedback signal in wireless communication system

SAMSUNG ELECTRONICS CO LTD3 citations73
US11552758B2Jan 10, 2023

Resource allocation device and method in large-scale antenna system

SAMSUNG ELECTRONICS CO LTD2 citations73
US11212059B2Dec 28, 2021

Method and apparatus for managing contention window in wireless communication system

SAMSUNG ELECTRONICS CO LTD2 citations73
US11076387B2Jul 27, 2021

Method and device for transmitting or receiving control information in wireless communication system

SAMSUNG ELECTRONICS CO LTD5 citations73
US10983204B2Apr 20, 2021

Method and apparatus for determining object direction

SAMSUNG ELECTRONICS CO LTD3 citations73
US10972164B2Apr 6, 2021

Method and device for transmitting and receiving feedback signal in wireless communication system

SAMSUNG ELECTRONICS CO LTD2 citations73
US10693615B2Jun 23, 2020

Method and apparatus for managing contention window in wireless communication system

SAMSUNG ELECTRONICS CO LTD2 citations73
US10674550B2Jun 2, 2020

Method and apparatus for performing radio link monitoring in a wireless communication system

SAMSUNG ELECTRONICS CO LTD4 citations73
US10542531B2Jan 21, 2020

Method and apparatus for transmitting and receiving downlink control channel in wireless communication system

SAMSUNG ELECTRONICS CO LTD4 citations73
US10536242B2Jan 14, 2020

Method and apparatus for performing repetitive transmission of information in time division duplex based cell in wireless communication system

SAMSUNG ELECTRONICS CO LTD2 citations73
US10511420B2Dec 17, 2019

Method and device for receiving broadcast information in communication system

SAMSUNG ELECTRONICS CO LTD2 citations73
US10499426B2Dec 3, 2019

Method and apparatus for channel sensing in communication system

SAMSUNG ELECTRONICS CO LTD6 citations73
US10425897B2Sep 24, 2019

Method and device for controlling transmission power in wireless communication system using multiple antennas

SAMSUNG ELECTRONICS CO LTD2 citations73
US10069550B2Sep 4, 2018

Method and apparatus for generating and reporting feedback information in mobile communication system

SAMSUNG ELECTRONICS CO LTD4 citations73
US7579552B2Aug 25, 2009

Tab tape for tape carrier package

SAMSUNG ELECTRONICS CO LTD7 citations73
US7309916B2Dec 18, 2007

Semiconductor package and method for its manufacture

SAMSUNG ELECTRONICS CO LTD9 citations73
US7888237B2Feb 15, 2011

Method of cutting semiconductor wafer, semiconductor chip apparatus, and chamber to cut wafer

SAMSUNG ELECTRONICS CO LTD3 citations63

LG ELECTRONICS INC

5 patents

KOREA ELECTRONICS TELECOMM

2 patents

KIM DONG-HAN

2 patents

LG PHILIPS LCD CO LTD

1 patent

LEE SANG-RYUL

1 patent

HA TAE-YOUNG

1 patent

KIM SUNG-GI

1 patent

NA YUN-SUNG

1 patent

KOREA DELPHI AUTOMOTIVE SYSTEM

1 patent

LEE JUNG-DO

1 patent

TECHWING CO LTD

1 patent

KIM KWANG SOON

1 patent

HAII CORP

1 patent

Showing the top 50 of 112 patents by PatentIndex Score.