Inventor
KELKAR NIKHIL
US20 patents
⚠️ This page may combine multiple inventors who share the name “KELKAR NIKHIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NAT SEMICONDUCTOR CORP
13 patentsUS6607941B2Aug 19, 2003
Process and structure improvements to shellcase style packaging technology
NAT SEMICONDUCTOR CORP141 citations98
US6238949B1May 29, 2001
Method and apparatus for forming a plastic chip on chip package module
NAT SEMICONDUCTOR CORP156 citations98
US7301222B1Nov 27, 2007
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
NAT SEMICONDUCTOR CORP55 citations94
US6352881B1Mar 5, 2002
Method and apparatus for forming an underfill adhesive layer
NAT SEMICONDUCTOR CORP70 citations94
US6932136B1Aug 23, 2005
Post singulation die separation apparatus and method for bulk feeding operation
NAT SEMICONDUCTOR CORP19 citations92
US7413927B1Aug 19, 2008
Apparatus for forming a pre-applied underfill adhesive layer for semiconductor wafer level chip-scale packages
NAT SEMICONDUCTOR CORP44 citations91
US7253078B1Aug 7, 2007
Method and apparatus for forming an underfill adhesive layer
NAT SEMICONDUCTOR CORP31 citations91
US6803648B1Oct 12, 2004
Integrated circuit packages with interconnects on top and bottom surfaces
NAT SEMICONDUCTOR CORP22 citations90
US6566762B1May 20, 2003
Front side coating for bump devices
NAT SEMICONDUCTOR CORP15 citations80
US6001723ADec 14, 1999
Application of wire bond loop as integrated circuit package component interconnect
NAT SEMICONDUCTOR CORP12 citations74
US7045035B1May 16, 2006
Post singulation die separation apparatus and method for bulk feeding operation
NAT SEMICONDUCTOR CORP8 citations73
US6468892B1Oct 22, 2002
Front side coating for bump devices
NAT SEMICONDUCTOR CORP7 citations69
US7510908B1Mar 31, 2009
Method to dispense light blocking material for wafer level CSP
NAT SEMICONDUCTOR CORP5 citations60