Inventor

YANG DAEWOOK

KR8 patents

⚠️ This page may combine multiple inventors who share the name “YANG DAEWOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG DAEWOOK

3 patents

US8409918B2Apr 2, 2013

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mounting

YANG DAEWOOK9 citations81

US8841782B2Sep 23, 2014

Integrated circuit package system with mold gate

YANG DAEWOOK0 citations49

US8709877B2Apr 29, 2014

Integrated circuit packaging system with an encapsulation and method of manufacture thereof

YANG DAEWOOK1 citations48

LEE KYUNGHOON

2 patents

US8421201B2Apr 16, 2013

Integrated circuit packaging system with underfill and methods of manufacture thereof

LEE KYUNGHOON13 citations82

US9053953B1Jun 9, 2015

Integrated circuit packaging system with underfill and method of manufacture thereof

LEE KYUNGHOON1 citations50

LEE HUNTEAK

1 patent

US8936969B2Jan 20, 2015

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

LEE HUNTEAK2 citations55

STATS CHIPPAC LTD

1 patent

US8836097B2Sep 16, 2014

Semiconductor device and method of forming pre-molded substrate to reduce warpage during die molding

STATS CHIPPAC LTD1 citations51

LEE HUN TEAK

1 patent

US8716108B2May 6, 2014

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

LEE HUN TEAK0 citations39