Inventor

PEPE ANGEL

US4 patents

⚠️ This page may combine multiple inventors who share the name “PEPE ANGEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

OZGUZ VOLKAN

1 patent

US7786562B2Aug 31, 2010

Stackable semiconductor chip layer comprising prefabricated trench interconnect vias

OZGUZ VOLKAN11 citations77

IRVINE SENSORS CORP

1 patent

US7239012B2Jul 3, 2007

Three-dimensional module comprised of layers containing IC chips with overlying interconnect layers

IRVINE SENSORS CORP5 citations69

PFG IP LLC

1 patent

US9741680B1Aug 22, 2017

Wire bond through-via structure and method

PFG IP LLC0 citations47

BINDRUP RANDY

1 patent

US9431275B2Aug 30, 2016

Wire bond through-via structure and method

BINDRUP RANDY1 citations46