Inventor
LIM SHOA-SIONG RAYMOND
SG10 patents
⚠️ This page may combine multiple inventors who share the name “LIM SHOA-SIONG RAYMOND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANPACK SOLUTIONS PTE LTD
9 patentsUS9653323B2May 16, 2017
Manufacturing method of substrate structure having embedded interconnection layers
ADVANPACK SOLUTIONS PTE LTD12 citations82
US9892916B2Feb 13, 2018
Manufacturing method of package substrate and package manufacturing method of semiconductor device
ADVANPACK SOLUTIONS PTE LTD3 citations71
US9379044B2Jun 28, 2016
Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof
ADVANPACK SOLUTIONS PTE LTD2 citations61
US9301391B2Mar 29, 2016
Substrate structure, semiconductor package device, and manufacturing method of substrate structure
ADVANPACK SOLUTIONS PTE LTD2 citations61
US9219027B2Dec 22, 2015
Semiconductor device carrier and semiconductor package using the same
ADVANPACK SOLUTIONS PTE LTD3 citations59
US10154588B2Dec 11, 2018
Manufacturing method of semiconductor package
ADVANPACK SOLUTIONS PTE LTD0 citations50
US9754899B2Sep 5, 2017
Semiconductor structure and method of fabricating the same
ADVANPACK SOLUTIONS PTE LTD0 citations50
US9723717B2Aug 1, 2017
Substrate structure, semiconductor package device, and manufacturing method of semiconductor package
ADVANPACK SOLUTIONS PTE LTD0 citations50
US9583449B2Feb 28, 2017
Semiconductor package
ADVANPACK SOLUTIONS PTE LTD0 citations45