Inventor

BAUER MICHAEL

DE189 patents

⚠️ This page may combine multiple inventors who share the name “BAUER MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BAUER MICHAEL

INFINEON TECHNOLOGIES AG

Semiconductor device with a wiring substrate and method for producing the same

Module with a shielding and/or heat dissipating element

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Semiconductor device including electronic component coupled to a backside of a chip

Method for producing through-contacts and a semiconductor component with through-contacts

Semiconductor device having a sensor chip, and method for producing the same

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Sensor component with a cavity housing and a sensor chip and method for producing the same

Electronic component and semiconductor wafer, and method for producing the same

Semiconductor component and sensor component for data transmission devices

Semiconductor component with electromagnetic shielding device

Semiconductor module with at least two substrates

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Semiconductor device having an adhesion promoting layer and method for producing it

Semiconductor module having discrete components and method for producing the same

Semiconductor component including semiconductor chip and method for producing the same

Electronic circuit in a package-in-package configuration and production method

Semiconductor device with semiconductor chip and method for producing it

Package for an electronic component and method for its production

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Electronic structure with components connected by way of solderable connecting elements and method

BAUER MICHAEL

Knowledge based method and system for local commerce

Semiconductor device having a semiconductor chip, and method for the production thereof

Concrete vapor barrier integrity system

Method and system for modulating media packets

Concrete vapor barrier integrity system

CIBA SC HOLDING AG

Method for producing adhesive surface coatings

Process for the preparation of UV protective coatings by plasma-enhanced deposition

Process for the production of strongly adherent coatings

Process for the production of strongly adherent surface-coatings by plasma-activated grafting

NEXXUS LIGHTING INC

Submersible LED light fixture

FRAUNHOFER GES FORSCHUNG

Electrode membrane

GEITNER OTTMAR

Chip package and a method for manufacturing a chip package

DOERFLER WALTER

Security element having a laser marking

MANN & HUMMEL FILTER

Closure device for a conveying unit operating in a vacuum

MAHLER JOACHIM

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

(unassigned)

Joint optionally usable to form a jointed golf club

VANTICO INC

Flowable glanulates

NOVOZYMES AS

Protease variants and polynucleotides encoding same

VOLKSWAGEN AG

Display device for a motor vehicle

PARAGON AG

Micromechanical component

DRAEXLMAIER LISA GMBH

Pre-assembly unit for a motor vehicle door

TOLNAR JEFF

System and method for adaptive islanding for stored/distributed energy devices

DORNIER GMBH

Process and apparatus for noise reduction in multi-engine propeller-driven aircraft

BASF AG

Polyurethane composite components and their use in exterior bodywork parts