Inventor
STROBEL PETER
DE30 patents
⚠️ This page may combine multiple inventors who share the name “STROBEL PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
24 patentsUS7276785B2Oct 2, 2007
Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof
INFINEON TECHNOLOGIES AG68 citations95
US7943423B2May 17, 2011
Reconfigured wafer alignment
INFINEON TECHNOLOGIES AG28 citations92
US7575173B2Aug 18, 2009
Smart card, smart card module, and a method for production of a smart card module
INFINEON TECHNOLOGIES AG22 citations92
US7420262B2Sep 2, 2008
Electronic component and semiconductor wafer, and method for producing the same
INFINEON TECHNOLOGIES AG52 citations92
US9673170B2Jun 6, 2017
Batch process for connecting chips to a carrier
INFINEON TECHNOLOGIES AG2 citations72
US10832992B2Nov 10, 2020
Die attach methods and semiconductor devices manufactured based on such methods
INFINEON TECHNOLOGIES AG1 citations68
US10396015B2Aug 27, 2019
Die attach methods and semiconductor devices manufactured based on such methods
INFINEON TECHNOLOGIES AG2 citations68
US7700956B2Apr 20, 2010
Sensor component and panel used for the production thereof
INFINEON TECHNOLOGIES AG4 citations63
US7524699B2Apr 28, 2009
Electronic component and a panel
INFINEON TECHNOLOGIES AG4 citations63
US7391103B2Jun 24, 2008
Electronic module having plug contacts and method for producing it
INFINEON TECHNOLOGIES AG2 citations63
US11502042B2Nov 15, 2022
Processing of one or more carrier bodies and electronic components by multiple alignment
INFINEON TECHNOLOGIES AG0 citations62
US7547645B2Jun 16, 2009
Method for coating a structure comprising semiconductor chips
INFINEON TECHNOLOGIES AG2 citations62
US7470601B2Dec 30, 2008
Semiconductor device with semiconductor chip and adhesive film and method for producing the same
INFINEON TECHNOLOGIES AG3 citations58
US11296015B2Apr 5, 2022
Die attach methods and semiconductor devices manufactured based on such methods
INFINEON TECHNOLOGIES AG0 citations57
US7919857B2Apr 5, 2011
Plastic housing and semiconductor component with said plastic housing
INFINEON TECHNOLOGIES AG0 citations52
US7749864B2Jul 6, 2010
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US7592236B2Sep 22, 2009
Method for applying a structure of joining material to the back surfaces of semiconductor chips
INFINEON TECHNOLOGIES AG0 citations52
US7294916B2Nov 13, 2007
Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
INFINEON TECHNOLOGIES AG0 citations52
US11710684B2Jul 25, 2023
Package with separate substrate sections
INFINEON TECHNOLOGIES AG0 citations51
US7893532B2Feb 22, 2011
External contact material for external contacts of a semiconductor device and method of making the same
INFINEON TECHNOLOGIES AG1 citations51
US7772105B2Aug 10, 2010
Semiconductor component with plastic housing, and process for producing the same
INFINEON TECHNOLOGIES AG0 citations50
US7327023B2Feb 5, 2008
Semiconductor component with plastic housing, and process for producing the same
INFINEON TECHNOLOGIES AG0 citations50
US7602614B2Oct 13, 2009
Electronic module and method for the production thereof
INFINEON TECHNOLOGIES AG0 citations49
US7662664B2Feb 16, 2010
Electronic circuit in a package-on-package configuration and method for producing the same
INFINEON TECHNOLOGIES AG0 citations41