Inventor

WOERNER HOLGER

DE32 patents

⚠️ This page may combine multiple inventors who share the name “WOERNER HOLGER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOERNER HOLGER

INFINEON TECHNOLOGIES AG

Semiconductor device with a wiring substrate and method for producing the same

Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Semiconductor module with a semiconductor stack, and methods for its production

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

Method for producing through-contacts and a semiconductor component with through-contacts

Smart card, smart card module, and a method for production of a smart card module

Electronic component with a plastic package and method for production

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

Electronic package having integrated cooling element with clearance for engaging package

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

Electronic component and process for producing the electronic component

Semiconductor structure with a plastic housing and separable carrier plate

Semiconductor component with electromagnetic shielding device

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Sensor component and panel used for the production thereof

Device including a housing for a semiconductor chip including leads extending into the housing

Electronic component and a panel

Method for manufacturing semiconductor component with a media channel

Semiconductor device with a recessed bond pad

Electronic module having plug contacts and method for producing it

Electronic component with a stack of semiconductor chips and a method for producing the electronic component

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

External contact material for external contacts of a semiconductor device and method of making the same

Electronic component with at least one semiconductor chip and method for its manufacture

Semiconductor component with plastic housing, and process for producing the same

Semiconductor component with plastic housing, and process for producing the same

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

QIMONDA AG

Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel

BAUER MICHAEL

Semiconductor device stack and method for its production

SIEMENS AG

Biosensor with smart card configuration