Inventor

TANG GONGYUE

SG2 patents

Patents

2 patents

US11515237B2Nov 29, 2022

Plurality of heat sinks for a semiconductor package

AGENCY SCIENCE TECH & RES2 citations68

US11948861B2Apr 2, 2024

Liquid cooling module and method of forming the same

AGENCY SCIENCE TECH & RES0 citations43