P

Inventor

HUDSON ERIC A

US89 patents
⚠️ This page may combine multiple inventors who share the name “HUDSON ERIC A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

28 patents
US9997373B2Jun 12, 2018

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP434 citations99
US9039911B2May 26, 2015

Plasma-enhanced etching in an augmented plasma processing system

LAM RES CORP57 citations98
US6916746B1Jul 12, 2005

Method for plasma etching using periodic modulation of gas chemistry

LAM RES CORP77 citations98
US6255221B1Jul 3, 2001

Methods for running a high density plasma etcher to achieve reduced transistor device damage

LAM RES CORP369 citations98
US9396961B2Jul 19, 2016

Integrated etch/clean for dielectric etch applications

LAM RES CORP105 citations96
US9543148B1Jan 10, 2017

Mask shrink layer for high aspect ratio dielectric etch

LAM RES CORP56 citations95
US9887097B2Feb 6, 2018

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP20 citations94
US9620377B2Apr 11, 2017

Technique to deposit metal-containing sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP25 citations93
US9543158B2Jan 10, 2017

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP28 citations93
US9384998B2Jul 5, 2016

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP32 citations93
US9997372B2Jun 12, 2018

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP18 citations92
US9378971B1Jun 28, 2016

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP43 citations92
US7749353B2Jul 6, 2010

High aspect ratio etch using modulation of RF powers of various frequencies

LAM RES CORP30 citations92
US7294580B2Nov 13, 2007

Method for plasma stripping using periodic modulation of gas chemistry and hydrocarbon addition

LAM RES CORP29 citations92
US7144521B2Dec 5, 2006

High aspect ratio etch using modulation of RF powers of various frequencies

LAM RES CORP24 citations92
US7250371B2Jul 31, 2007

Reduction of feature critical dimensions

LAM RES CORP27 citations91
US6228278B1May 8, 2001

Methods and apparatus for determining an etch endpoint in a plasma processing system

LAM RES CORP28 citations89
US10304693B2May 28, 2019

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP7 citations84
US10170324B2Jan 1, 2019

Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch

LAM RES CORP13 citations84
US9793126B2Oct 17, 2017

Ion to neutral control for wafer processing with dual plasma source reactor

LAM RES CORP18 citations84
US9735020B2Aug 15, 2017

System, method and apparatus for plasma etch having independent control of ion generation and dissociation of process gas

LAM RES CORP9 citations84
US7455748B2Nov 25, 2008

Magnetic enhancement for mechanical confinement of plasma

LAM RES CORP9 citations84
US7273815B2Sep 25, 2007

Etch features with reduced line edge roughness

LAM RES CORP13 citations84
US7192531B1Mar 20, 2007

In-situ plug fill

LAM RES CORP14 citations84
US7022611B1Apr 4, 2006

Plasma in-situ treatment of chemically amplified resist

LAM RES CORP14 citations84
US10297459B2May 21, 2019

Technique to deposit sidewall passivation for high aspect ratio cylinder etch

LAM RES CORP7 citations83
US7541291B2Jun 2, 2009

Reduction of feature critical dimensions

LAM RES CORP11 citations83
US10431458B2Oct 1, 2019

Mask shrink layer for high aspect ratio dielectric etch

LAM RES CORP11 citations82

UNITED TECHNOLOGIES CORP

12 patents

HUDSON ERIC A

4 patents

MCCAFFREY MICHAEL G

3 patents

RAYTHEON TECH CORP

1 patent

CAPRARIO JOSEPH T

1 patent

JOE CHRISTOPHER R

1 patent

Showing the top 50 of 89 patents by PatentIndex Score.