Inventor
DROFITZ JR STEPHEN S
US7 patents
Patents
7 patentsUS5990418ANov 23, 1999
Hermetic CBGA/CCGA structure with thermal paste cooling
IBM156 citations97
US5881945AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates and process
IBM57 citations96
US5881944AMar 16, 1999
Multi-layer solder seal band for semiconductor substrates
IBM53 citations96
US5981310ANov 9, 1999
Multi-chip heat-sink cap assembly
IBM59 citations95
US6373133B1Apr 16, 2002
Multi-chip module and heat-sink cap combination
IBM34 citations92
US6214647B1Apr 10, 2001
Method for bonding heatsink to multiple-height chip
IBM19 citations81
US4272722AJun 9, 1981
Determination of electric current flow patterns
IBM0 citations51