Inventor
MITCHELL CRAIG S
US38 patents
⚠️ This page may combine multiple inventors who share the name “MITCHELL CRAIG S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INC
33 patentsUS6329224B1Dec 11, 2001
Encapsulation of microelectronic assemblies
TESSERA INC160 citations99
US6046076AApr 4, 2000
Vacuum dispense method for dispensing an encapsulant and machine therefor
TESSERA INC143 citations99
US5776796AJul 7, 1998
Method of encapsulating a semiconductor package
TESSERA INC173 citations99
US5659952AAug 26, 1997
Method of fabricating compliant interface for semiconductor chip
TESSERA INC491 citations99
US9153562B2Oct 6, 2015
Stacked packaging improvements
TESSERA INC60 citations98
US8927337B2Jan 6, 2015
Stacked packaging improvements
TESSERA INC76 citations98
US6977440B2Dec 20, 2005
Stacked packages
TESSERA INC168 citations98
US6126428AOct 3, 2000
Vacuum dispense apparatus for dispensing an encapsulant
TESSERA INC99 citations98
US6897565B2May 24, 2005
Stacked packages
TESSERA INC101 citations97
US6885106B1Apr 26, 2005
Stacked microelectronic assemblies and methods of making same
TESSERA INC78 citations97
US7759782B2Jul 20, 2010
Substrate for a microelectronic package and method of fabricating thereof
TESSERA INC47 citations96
US6870272B2Mar 22, 2005
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC55 citations96
US6723584B2Apr 20, 2004
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC39 citations96
US6602740B1Aug 5, 2003
Encapsulation of microelectronic assemblies
TESSERA INC71 citations96
US6541874B2Apr 1, 2003
Encapsulation of microelectronic assemblies
TESSERA INC41 citations96
US6525429B1Feb 25, 2003
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC69 citations96
US6458628B1Oct 1, 2002
Methods of encapsulating a semiconductor chip using a settable encapsulant
TESSERA INC59 citations96
US6197665B1Mar 6, 2001
Lamination machine and method to laminate a coverlay to a microelectronic package
TESSERA INC62 citations96
US6169328B1Jan 2, 2001
Semiconductor chip assembly
TESSERA INC150 citations96
US6133639AOct 17, 2000
Compliant interface for semiconductor chip and method therefor
TESSERA INC66 citations96
US6080605AJun 27, 2000
Methods of encapsulating a semiconductor chip using a settable encapsulant
TESSERA INC58 citations96
US7224056B2May 29, 2007
Back-face and edge interconnects for lidded package
TESSERA INC53 citations95
US6521480B1Feb 18, 2003
Method for making a semiconductor chip package
TESSERA INC64 citations94
US7368818B2May 6, 2008
Methods of making microelectronic assemblies including compliant interfaces
TESSERA INC18 citations93
US6218215B1Apr 17, 2001
Methods of encapsulating a semiconductor chip using a settable encapsulant
TESSERA INC35 citations93
US7534652B2May 19, 2009
Microelectronic elements with compliant terminal mountings and methods for making the same
TESSERA INC19 citations92
US7335995B2Feb 26, 2008
Microelectronic assembly having array including passive elements and interconnects
TESSERA INC35 citations92
US6913949B2Jul 5, 2005
Stacked packages
TESSERA INC35 citations92
US7368695B2May 6, 2008
Image sensor package and fabrication method
TESSERA INC50 citations89
US6897090B2May 24, 2005
Method of making a compliant integrated circuit package
TESSERA INC11 citations74
US9570416B2Feb 14, 2017
Stacked packaging improvements
TESSERA INC0 citations52
US7309910B2Dec 18, 2007
Micro lead frame packages and methods of manufacturing the same
TESSERA INC1 citations52
US7202112B2Apr 10, 2007
Micro lead frame packages and methods of manufacturing the same
TESSERA INC1 citations52
HABA BELGACEM
5 patentsUS8525314B2Sep 3, 2013
Stacked packaging improvements
HABA BELGACEM98 citations99
US8071424B2Dec 6, 2011
Substrate for a microelectronic package and method of fabricating thereof
HABA BELGACEM49 citations96
US8067267B2Nov 29, 2011
Microelectronic assemblies having very fine pitch stacking
HABA BELGACEM14 citations84
US8531020B2Sep 10, 2013
Stacked packaging improvements
HABA BELGACEM2 citations63
US8686551B2Apr 1, 2014
Substrate for a microelectronic package and method of fabricating thereof
HABA BELGACEM0 citations51