Inventor

WU YAN-YI

CN5 patents

⚠️ This page may combine multiple inventors who share the name “WU YAN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPMOS TECHNOLOGIES BERMUDA

2 patents

US7741149B2Jun 22, 2010

Method of fabricating chip package structure

CHIPMOS TECHNOLOGIES BERMUDA6 citations56

US7683462B2Mar 23, 2010

Chip package structure

CHIPMOS TECHNOLOGIES BERMUDA0 citations46

CHIPMOS TECHNOLOGIES SHANGHAI

1 patent

US7361984B2Apr 22, 2008

Chip package structure

CHIPMOS TECHNOLOGIES SHANGHAI16 citations74

QIAO YONG-CHAO

1 patent

US8088650B2Jan 3, 2012

Method of fabricating chip package

QIAO YONG-CHAO2 citations50

CHIOU JIE-HUNG

1 patent

US8105881B2Jan 31, 2012

Method of fabricating chip package structure

CHIOU JIE-HUNG0 citations39